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HMC814 Die Data Sheet10/20/2015PDF655 K
Overview
Features and Benefits
- High Output Power: +17 dBm
- Low Input Power Drive: 0 to +6 dBm
- Fo Isolation: >20 dBc @ Fout = 19 GHz
- 100 kHz SSB Phase Noise: -136 dBc/Hz
- Single Supply: +5V @ 88mA
- Die Size: 1.2 × 1.23 x 0.1 mm
Product Details
The HMC814 is a x2 active broadband frequency multiplier chip utilizing GaAs PHEMT technology. When driven by a +4 dBm signal, the multiplier provides +17 dBm typical output power from 13 to 24.6 GHz. The Fo, 3Fo and 4Fo isolations are >20 dBc at 19 GHz. The HMC814 is ideal for use in LO multiplier chains for Pt-to-Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -136 dBc/Hz at 100 kHz offset helps maintain good system noise performance. All data is taken with the chip connected via two 0.025mm (1 mil) wire bonds of minimal length 0.31 mm (12 mils).
APPLICATIONS
- Clock Generation Applications:
SONET OC-192 & SDH STM-64 - Point-to-Point & VSAT Radios
- Test Instrumentation
- Military End-Use
- Sensors
Product Categories
Product Lifecycle
Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
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RF, Microwave, and Millimeter Wave Product Selection Guide7/13/2018PDF9M
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Semiconductor Qualification Test Report: PHEMT-F (QTR: 2013-00269)10/29/2015PDF824 K
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
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HMC814 | Material Declaration | Reliability Data | CHIPS OR DIE | |
HMC814-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
Wafer Fabrication Data |
Sample & Buy
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List Pricing
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Lead Times
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Sampling
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