HMC797

Obsolete

HMC797 / HMC797LP5E

1-Watt Power Amplifier Chip or SMT, DC to 22 GHz

Part Models: 4
1ku List Price: price unavailable

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Overview

High P1dB output power: +28 dBm
High PSAT output power: +29.5 dBm, +31 dBm
High gain: 13.5 dB, 14.5 dB
High output IP3: +39 dBm, +40 dBm
Supply voltage: +10 V at 400 mA
50 Ω matched input/output
Die size: 2.89 × 1.55 × 0.1 mm
32-lead, 5 × 5 mm, surface-mount technology (SMT) package

The HMC797 devices are GaAs, monolithic microwave integrated circuit (MMIC), and PHEMT distributed power amplifiers which operate between dc and 22 GHz. These amplifiers provide up to 13.5 dB or 14.5 dB of gain, +39 dBm or +40 dBm of output IP3, and +28 dBm of output power at 1 dB gain compression, while requiring 400 mA from a +10 V supply. These versatile power amplifiers exhibit a positive gain slope from dc to 22 GHz, making them ideal for EW, ECM, radar, and test equipment applications. The inputs/outputs of these devices are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All chip data is taken with the chip connected via two 0.025 mm (1 mil) wire bonds of minimal 0.31 mm (12 mils) length. The power amplifier SMT is packaged in a leadless, QFN, 5 × 5 mm, surface-mount package and requires no external matching components.

Applications

Test instrumentation
Microwave radio and VSAT
Military and space
Telecom infrastructure
Fiber optics

Alternative Part 2

GaAs pHEMT MMIC 1 Watt Power Amplifier, DC - 22 GHz

Part Models: 4
1ku List Price: price unavailable

Documentation

Data Sheet 2

HMC797 Die Data Sheet 04/12/2015

HMC797LP5E Data Sheet 04/12/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC797	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC797-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC797LP5E	32-Lead QFN (5mm x 5mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC797LP5ETR	32-Lead QFN (5mm x 5mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jan 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products
		PDN16_0010_Form Material_Report
HMC797
HMC797-SX	Obsolete
HMC797LP5E
HMC797LP5ETR