HMC634 Die Data Sheet10/19/2015
Features and Benefits
- Gain: 22 dB
- P1dB: +23 dBm
- Output IP3: +31 dBm
- Saturated Power: 24 dBm @ 23% PAE
- Supply Voltage: +5 V @ 180 mA
- 50 Ohm Matched Input/Output
- Die Size: 2.07 x 0.97 x
The HMC634 is a GaAs MMIC PHEMT Driver Amplifier die which operates between 5 and 20 GHz. The amplifier provides up to 22 dB of gain, +31 dBm Output IP3, and up to +23 dBm of output power at 1 dB gain compression, while requiring 180 mA from a +5V supply. The HMC634 is an ideal driver amplifier for microwave radio applications from 5 to 20 GHz, and may be biased at +5V, 130 mA to provide 2 dB lower gain with improved PAE. The HMC634 amplifier I/O’s are DC blocked and internally matched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is taken with die connected at input and output RF ports via one 1 mil wedge bond with minimal length of 0.31 mm (12 mils).
- Point-to-Point Radios
- Point- to-Multi-Point Radios & VSAT
- LO Driver for Mixers
- Military & Space
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC634||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC634-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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