HMC554

HMC554 / HMC554LC3B

GaAs monolithic microwave integrated circuit (MMIC) double-balanced mixer chip and surface mount technology (SMT), 11 GHz to 20 GHz

Data Sheet

Part Models: 4
1ku List Price: price unavailable

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Overview

High local oscillator (LO) radio frequency (RF) isolation: 46 dBm
Passive double-balanced topology
Low conversion loss: 7 dB

Wide intermediate frequency (IF) bandwidth: dc to 6 GHz
Small size (HMC554): 0.83 mm × 1.12 mm × 0.1 mm
RoHS compliant 3 mm ×3 mm SMT package (HMC554LC3B)

The HMC554 devices are passive (HMC554) and general purpose (HMC554LC3B) double-balanced mixers that are available in a chip (HMC554) and a leadless RoHS compliant SMT package (HMC554LC3B), both of which can be used as an upconverter or downconverter between 11 GHz and 20 GHz. These mixers are fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process, and require no external components or matching circuitry. The HMC554G devices provide excellent LO to RF and LO to IF isolation due to optimized balun structures. Measurements were made with the HMC554 chip mounted into in a 50 Ω test fixture and includes the parasitic effects of wire bond assembly. Connections were made with a 1 mil wire bond with minimal length (<12 mil). The RoHS compliant HMC554LC3B eliminates the need for wire bonding, and is compatible with high volume surface mount manufacturing techniques.

Applications

Point-to-point radios
Point-to-multipoint radios
Test equipment and sensors
Military end use
Microwave radio
Space
Communications, radar, and electronic warfare (EW)

Part Models: 4
1ku List Price: price unavailable

Documentation

Data Sheet 2

HMC554LC3B Data Sheet 04/15/2015

HMC554 Die Data Sheet 04/15/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC554	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC554LC3B	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC554LC3BTR	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC554LC3BTR-R5	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jan 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products
		PDN16_0010_Form Material_Report
HMC554
HMC554LC3B
HMC554LC3BTR
HMC554LC3BTR-R5