Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR: 05006 REV: 02)4/25/20170 M
Package/Assembly Qualification Test Report: LP4, LP4B, LP4C, LP4K (QTR: 2013-00487 REV: 04)10/29/20151M
Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247)4/22/2015798 K
HMC Legacy PDN: PCN14004610/2/201456K
Product Lifecycle Obsolete
The models in this product family are no longer available.
To find replacement products for this part:
Evaluation Kits (1)
This page contains ordering information for evaluating the HMC552LP4.
Documentation & Resources
4 x 4 mm QFN Tape Specification (LP4, LP4B, LP4C, LC4, LC4B)10/28/2015458 K
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC552LP4||Material Declaration||Reliability Data||16-Lead LFCSP (3mm x 3mm w/ EP)|
|HMC552LP4E||Material Declaration||Reliability Data||24-Lead QFN (4mm x 4mm w/ EP)|
|HMC552LP4ETR||Material Declaration||Reliability Data||24-Lead QFN (4mm x 4mm w/ EP)|
|HMC552LP4TR||Material Declaration||Reliability Data||16-Lead LFCSP (3mm x 3mm w/ EP)|
|Wafer Fabrication Data|
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