Package/Assembly Qualification Test Report: 16L 3x3mm QFN Package (QTR: 11003 REV: 02)5/3/20191 M
Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR: 05006 REV: 02)4/25/20170 M
Semiconductor Qualification Test Report: SiGe HBT-A (QTR: 2013-00227)3/2/2016776 K
Package/Assembly Qualification Test Report: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G (QTR: 2014-0364)10/29/20151 M
Product Lifecycle Obsolete
The models in this product family are no longer available.
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Evaluation Kits (1)
This page contains ordering information for evaluating the HMC495LP3.
Documentation & Resources
SiGe Direct Modulators Ease Upconverter Design4/22/20152 M
LP3, LC3, LC3B Tape and Reel Outline Dimensions4/1/2015381 K
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC495LP3||Material Declaration||Reliability Data||16-Lead QFN (3mm x 3mm w/ EP)|
|HMC495LP3E||Material Declaration||Reliability Data||16-Lead QFN (3mm x 3mm w/ EP)|
|HMC495LP3ETR||Material Declaration||Reliability Data||16-Lead QFN (3mm x 3mm w/ EP)|
|HMC495LP3TR||Material Declaration||Reliability Data||16-Lead QFN (3mm x 3mm w/ EP)|
|Wafer Fabrication Data|
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.