HMC461 Data Sheet3/22/2019681K
Features and Benefits
- +45 dBm Output IP3
- 12 dB Gain
- 48% PAE @ +30.5 dBm Pout
- +20 dBm W-CDMA Channel Power @ -45 dBc ACP
- 3x3 mm QFN SMT Package
The HMC461LP3(E) is a 1.7 - 2.2 GHz high output IP3 GaAs InGaP Heterojunction Bipolar Transistor (HBT) dual-channel MMIC amplifiers. The linear performance of two HMC455LP3 high IP3 drivers is offered in this single IC which can be configured in a balanced or push-pull amplifier circuit. The amplifier provides 12 dB of gain and +30.5 dBm of saturated power at 48% PAE from a single +5 Vdc supply while utilizing external baluns in a balanced configuration.
The high output IP3 of +45 dBm coupled with the low VSWR of 1.2:1 make the HMC461LP3(E) ideal driver amplifier for PCS/3G wireless infrastructures. A low cost, leadless 3x3 mm QFN surface mount package (LP3) houses the dual MMIC amplifier IC. The LP3 provides an exposed base for excellent RF and thermal performance.
- Multi-Carrier Systems
- GSM, GPRS & EDGE
- CDMA & W-CDMA
- Balanced or Push-Pull Configurable
Markets and Technologies
Product Lifecycle Last Time Buy
All products in this family will be obsolete soon. Please contact ADI Sales or Distributors to arrange for final purchases and read our Obsolescence Information to review the time periods for placing final orders and receiving final shipments.
Evaluation Kits (1)
This page contains ordering information for evaluating the HMC461LP3.
Documentation & Resources
Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages (Rev. 0)8/9/2019247 K
Thermal Management for Surface Mount Components General Application Note11/11/2015189 K
RF, Microwave, and Millimeter Wave Product Selection Guide7/13/20189M
Package/Assembly Qualification Test Report: 16L 3x3mm QFN Package (QTR: 11003 REV: 02)5/3/20191 M
Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR: 05006 REV: 02)4/25/20170 M
Semiconductor Qualification Test Report: GaAs HBT-B (QTR: 2013-00229)10/29/2015799 K
Package/Assembly Qualification Test Report: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G (QTR: 2014-0364)10/29/20151 M
LP3, LC3, LC3B Tape and Reel Outline Dimensions4/1/2015381 K
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.