HMC448 Die Data Sheet4/20/2015
Features and Benefits
- Output Power: +11 dBm
- Wide Input Power Range: -4 to +6 dBm
- Fo, 3Fo Isolation: >20 dBc @ Fout= 20 GHz
- 100 KHz SSB Phase Noise: -135 dBc/Hz
- Single Supply: 5V @ 48 mA
- Die Size: 1.16 × 1.20 × 0.1 mm
The HMC448 die is a x2 active broadband frequency multiplier chip utilizing GaAs PHEMT technology. When driven by a 0 dBm signal, the multiplier provides +11 dBm typical output power from 19 to 25 GHz. The Fo and 3Fo isolations are >22 dBc up to 22 GHz. This multi-rate frequency multiplier can be used in the generation of a half rate clock for 40 Gbps systems or as part of a multiplier chain to generate a full rate 40 Gbps clock.
The HMC448 is also ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -135 dBc/Hz at 100 kHz offset helps maintain good system noise performance. All data is with the chip in a 50 ohm test fixture connected via 0.076 × 0.0127mm (3mil × 0.5mil) ribbon bonds of minimal length 0.31mm (<12mils).
- Clock Generation Applications:
SONET OC-192 & SDH STM-64
- Point-to-Point & VSAT Radios
- Test Instrumentation
- Military & Space
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
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|HMC448||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC448-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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