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Package/Assembly Qualification Test Report: Plastic Encapsulated QSOP (QTR: 02015 REV: 11)3/22/2019
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Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247)4/22/2015
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HMC Legacy PDN: PCN1400258/18/2014
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HMC Legacy PCN: QS##, QS##E and QS##G,QS##GE packages - Relocation of pre-existing production equipment to new building2/1/2013
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The models in this product family are no longer available.
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HMC380 S-Parameters
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