HMC327 Data Sheet4/22/2015
Features and Benefits
- Gain: 21 dB
- Saturated Power: +30 dBm
- 45% PAE
- Supply Voltage: +5V
- Power Down Capability
- Low External Part Count
The HMC327MS8G(E) is a high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC Power amplifier which operates between 3 and 4 GHz. The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and thermal performance. With a minimum of external components, the amplifier provides 21 dB of gain, +30 dBm of saturated power at 45% PAE from a +5V supply voltage. Power down capability is available to conserve current consumption when the amplifier is not in use.
- Wireless Local Loop
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
Documentation & Resources
Semiconductor Qualification Test Report: GaAs HBT-B (QTR: 2013-00229)10/29/2015
Package/Assembly Qualification Test Report: MS8G (QTR: 2014-00393)10/29/2015
PCN: MS, QS, SOT, SOIC Packages - Sn/Pb Plating Vendor Change1/17/2014
HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE packages - Relocation of pre-existing production equipment to new building2/1/2013
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC327MS8GE||Material Declaration||Reliability Data||8-Lead MSOP w/ EP|
|HMC327MS8GETR||Material Declaration||Reliability Data||8-Lead MSOP w/ EP|
|Wafer Fabrication Data|
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