HMC326
GaAs InGaP HBT Driver Amplifier SMT, 3.0 - 4.5 GHz
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Features
- Psat Output Power: +26 dBm
- > 40% PAE
- Output IP3: +36 dBm
- High Gain: 21 dB
- Vs: +5V
- Ultra Small Package: MSOP8G
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The HMC326MS8G & HMC326MS8GE are high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC driver amplifiers which operate between 3.0 and 4.5 GHz. The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and thermal performance. The amplifier provides 21 dB of gain and +26 dBm of saturated power from a +5V supply voltage. Power down capability is available to conserve current consumption when the amplifier is not in use. Internal circuit matching was optimized to provide greater than 40% PAE.
Applications
- Microwave Radios
- Broadband Radio Systems
- Wireless Local Loop Driver Amplifier
Ask a Question
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Search
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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HMC326
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| HMC326MS8G |
8-Lead MSOP w/ EP
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| HMC326MS8GE |
8-Lead MSOP w/ EP
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| HMC326MS8GETR |
8-Lead MSOP w/ EP
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| HMC326MS8GTR |
8-Lead MSOP w/ EP
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- HMC326MS8G
- Pin/Package Drawing
-
8-Lead MSOP w/ EP
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- HMC326MS8GE
- Pin/Package Drawing
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8-Lead MSOP w/ EP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- HMC326MS8GETR
- Pin/Package Drawing
-
8-Lead MSOP w/ EP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- HMC326MS8GTR
- Pin/Package Drawing
-
8-Lead MSOP w/ EP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
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Part Models
Product Lifecycle
PCN
May 6, 2019
- 19_0063
Assembly Site Transfer of Select MSOP and SOIC_N E-pad Devices to Carsem Malaysia
HMC326MS8G
PRODUCTION
HMC326MS8GE
PRODUCTION
HMC326MS8GETR
PRODUCTION
HMC326MS8GTR
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
May 6, 2019
- 19_0063
Assembly Site Transfer of Select MSOP and SOIC_N E-pad Devices to Carsem Malaysia
HMC326MS8G
PRODUCTION
HMC326MS8GE
PRODUCTION
HMC326MS8GETR
PRODUCTION
HMC326MS8GTR
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-HMC326MS8G
HMC326MS8G Evaluation Board
Product Detail
This page contains ordering information for evaluating the HMC326MS8G
Resources
Evaluation Kits1
Tools & Simulations 3
ADIsimRF
Sys-Parameter
S-Parameter 1
S-Parameter
