Package/Assembly Qualification Test Report: Plastic Encapsulated MSOP (QTR: 02016 REV: 01)4/22/2015
Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247)4/22/2015
PCN: MS, QS, SOT, SOIC Packages - Sn/Pb Plating Vendor Change1/17/2014
HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE packages - Relocation of pre-existing production equipment to new building2/1/2013
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.