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Package/Assembly Qualification Test Report: Plastic Encapsulated MSOP (QTR: 02016 REV: 01)4/22/2015
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Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247)4/22/2015
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PCN: MS, QS, SOT, SOIC Packages - Sn/Pb Plating Vendor Change1/17/2014
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HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE packages - Relocation of pre-existing production equipment to new building2/1/2013
Product Lifecycle
Obsolete
The models in this product family are no longer available.
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Evaluation Kits (1)
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HMC287 S-Parameters
15.73 K
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