HMC260

HMC260 / HMC260LC3B

GaAs monolithic microwave integrated circuit (MMIC) fundamental mixer chip and surface mount technology (SMT), 14 GHz to 26 GHz

Data Sheet

Part Models: 4
1ku List Price: price unavailable

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Overview

Passive: no dc bias required
Input IP3: 20 dBm
Local oscillator (LO) to radio frequency (RF) isolation
HMC260: 39 dB
HMC260LC3B: 40 dB
Small size (HMC260): 1.0 mm × 0.55 mm × 0.1 mm

Wide intermediate frequency (IF) bandwidth (HMC260LC3B): dc to 8 GHz
12-Lead ceramic 3 mm × 3 mm SMT package: 9 mm2 (HMC260LC3B)

The HMC260 devices are double-balanced mixers available as a passive chip (HMC260) and a general purpose, leadless RoHS compliant SMT package (HMC260LC3B), both of which can be used as an upconverter or downconverter between 14 GHz and 26 GHz. These mixers require no external components or matching circuitry and provide excellent LO to RF and LO to IF suppression due to optimized balun structures. The mixer operates with LO drive levels greater than 9 dBm. Measurements for the HMC260 were made with the chip mounted and bonded into in a 50 Ω test fixture. Data includes the parasitic effects of wire bond assembly. Connections were made with a 3 mil ribbon bond with minimal length (<12 mil).The HMC260LC3B eliminates the need for wire bonding, allowing use of surface mount manufacturing techniques.

Applications

Point-to-point radios
Point-to-multipoint radios and very small aperture terminal (VSAT)
Test equipment and sensors
Military end use

Part Models: 4
1ku List Price: price unavailable

Documentation

Data Sheet 2

HMC260 Die Data Sheet 04/16/2015

HMC260LC3B Data Sheet 04/16/2015

Application Note 1

Mixer Application Note 04/01/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC260	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC260LC3B	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC260LC3BTR	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC260LC3BTR-R5	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jan 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products
		PDN16_0010_Form Material_Report
HMC260	Obsolete
HMC260LC3B
HMC260LC3BTR
HMC260LC3BTR-R5	Obsolete