Features and Benefits
- Output power for 1 dB compression (P1dB): 21 dBm typical
- Saturated output power (PSAT): 22 dBm typical
- Gain: 19 dB typical
- Output third-order intercept (IP3): 28 dBm typical
- Supply voltage: 4 V at 320 mA
- 50 Ω matched input/output
- Die size: 2.3 mm × 1.8 mm × 0.102 mm
The HMC1144 is a gallium arsenide (GaAs), pseudomorphic high electron mobility transfer (pHEMT), monolithic microwave integrated circuit (MMIC), distributed power amplifier that operates from 35 GHz to 70 GHz. In the lower band of 35 GHz to 50 GHz, the HMC1144 provides 19 dB (typical) of gain, 28 dBm output IP3, and 19 dBm and 19.5 dBm, respectively, of output P1dB gain compression. In the upper band of 50 GHz to 70 GHz, the HMC1144 provides 19 dB (typical) of gain, 32 dBm output IP3, and 21 dBm of output power at 1 dB gain compression. The HMC1144 requires 320 mA from a 4 V supply. The HMC1144 amplifier inputs/outputs are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the chip connected via two 0.025 mm (1 mil) wire bonds of 0.076 mm (3 mil) minimal length.
- Test instrumentation
- Microwave radios and very small aperture terminals (VSATs)
- Military and space
- Telecommunications infrastructure
- Fiber optics
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC1144||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC1144-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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