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HMC1069

Obsolete

32Gbps Optical Modulator Driver

Product Selection Table

Part Models: 2
1ku List Price: price unavailable

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Overview

Low DC Power Dissipation, 0.70W for 6Vpp output swing at 5V and 1W for 7.5Vpp swing at 6V supply.
Integrated peak-detect function
High gain, 15dB at 16GHz

Low Additive RMS Jitter, <300 fsec
High Bandwidth, 12 psec Riseand Fall Times
Small Die Size:
1.71 x 1.35 x 0.10 mm

The HMC1069 is a broadband distributed amplifier optimized for time-domain performance with high bandwidth supporting data-rates up to 32Gbps.The output signal amplitude and cross point are adjustable through the control pins and the integrated peak detector feature is used for monitoring the output voltage signal levels during device's normal operation.

The HMC1069 is designed in GaAs MMIC PHEMT process and the device can support supply (Vdd) voltage range from 5V to 7V with excellent performance.

HMC1069 can be used as a post-stage driver in cascaded configuration when HMC1068 is utilized as pre-stage amplifier. HMC1069 can also be used as a single-stage driver to address aplications with lowoutput swing requirements.

The HMC1069 comes in a small die size and need minimal number of external components for decoupling only , which makes it well suited for driver integrated optical modulator chip-and-wire assemblies.

Applications

Up to 32Gbps optical modulator driver
Test and Measurement Instrumentation
Microwave Radio & VSAT
Military & Space

Part Models: 2
1ku List Price: price unavailable

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC1069	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC1069-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Oct 5, 2018 - 18_0060 Discontinuance of HMC products due to loss of manufacturing and supply capability.
		PDN18_0060_Form Material_Report
HMC1069	Obsolete
HMC1069-SX	Obsolete

HMC1069

Overview

Documentation

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