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  2. RF and Microwave
  3. Frequency Dividers, Multipliers, and Detectors
  4. Frequency Multipliers
  5. HMC-XTB110


Features and Benefits

  • Conversion Loss: 19 dB
  • Input Drive: +13 dBm
  • Passive: No DC Bias Required
  • Die Size: 1.1 × 1.4 × 0.1 mm

Product Details

The HMC-XTB110 is a monolithic ×3 Passive Frequency Multiplier which utilizes GaAs Shottky Diode technology, and exhibits low conversion loss and high Fo isolation. This wideband ×3 multiplier requires no DC power, and is targeted to high volume applications where frequency ×3 of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized. The HMC-XTB110 Passive ×3 MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ω environment and contacted with RF probes.


  • E-Band Communication Systems
  • Short-Haul/High Capacity Radios
  • Automotive Radar
  • Test & Measurement Equipment

Product Lifecycle icon-recommended Recommended for New Designs

This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.

Design Resources

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
HMC-XTB110 Material Declaration Reliability Data CHIPS OR DIE
HMC-XTB110-SX Material Declaration Reliability Data CHIPS OR DIE
HMC-XTB110-WP Material Declaration Reliability Data CHIPS OR DIE
Wafer Fabrication Data

Sample & Buy

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Buy Now Pricing

(**) Displayed Buy Now Price and Price Range is based on small quantity orders.


List Pricing

(*)The 1Ku list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.


Lead Times

Please see the latest communication from our CCO regarding lead times.



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