HMC-XDB112

RECOMMENDED FOR NEW DESIGNS

HMC-XDB112

x2 Passive Frequency Multiplier Chip, 20 - 30 GHz Output

RECOMMENDED FOR NEW DESIGNS

HMC-XDB112 Functional Block Diagram slide

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Features

Conversion Loss: 13 dB
Passive: No DC Bias Required
Input Drive: +13 dBm

High Fo Isolation: 30 dB
Die Size: 2.2 x 0.65 x 0.1 mm

Additional Details

The HMC-XDB112 is a monolithic Passive Frequency Doubler which utilizes GaAs Heterojunction Bipolar Transistor (HBT) technology, and is targeted to high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized and the HBT devices are fully passivated for reliable operation.

The HMC-XDB112 Passive Doubler MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.

APPLICATIONS

Point-to-Point Radios
VSAT
Test Instrumentation
Military & Space
Clock Generation

View All Documentation

Ask a Question

Submit your question below and we will return the best answer from ADI’s knowledge database:

Other places you can find help

Support

Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.

Visit the ADI Support Page

Ask the ADI community for help.

Ask the EngineerZone Community

FAQs

Sales & Ordering FAQs

Part Models 2

1ku List Price

price unavailable

Technical Documents 2

HMC-XDB112 Data Sheet 04/22/2015

38, 60 & 82 GHz MMICs for High Capacity Communication Links 05/05/2015

Reference Materials 1

RF, Microwave, and Millimeter Wave Product Selection Guide 07/13/2018

Design Resources 2

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC-XDB112	CHIPS OR DIE	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
HMC-XDB112-SX	CHIPS OR DIE	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys