DAC8221
Dual 12-Bit Buffered Multiplying CMOS D/A Converter
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Features
- Two Matched 12-Bit DACs on One Chip
- Packaged in a Narrow 0.3" 24-Pin DIP
- Direct Parallel Load of all 12 Bits for High Data Throughput
- 12-Bit Endpoint Linearity (±1/2 LSB Over Temperature)
- On-Chip Latches for Both DACs
- +5V to +15V Single Supply Operation
- DACs Matched to 0.2% Typically
- Four-Quadrant Multiplication
- Improved ESD Resistance
- Available in Die Form
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The DAC-8221 combines two identical 12-bit, multiplying, digital-to-analog converters into a single CMOS chip. This device is electrically similar to DAC-8212 with improved microprocessor interface timing and is packaged in a narrow 0.300" DIP. Monolithic construction offers excellent DAC-to-DAC matching and tracking over the full operating temperature range. The DAC-8221 consists of two thin-film R-2R resistor-ladder networks, two 12-bit data latches, one 12-bit input buffer, and control logic. The DAC-8221 operates on a single supply from +5V to +15V. Maximum power dissipation with 0V and +5V logic levels and a +5V supply is less than 0.5mW. The DAC-8221 is manufactured using PMI's highly-stable, thin film resistors on an advanced oxide-isolated, silicon-gate, CMOS process. PMI's improved latch-up resistant design eliminates the need for external protective Schottky diodes.
A common 12-bit (TTL/CMOS compatible) input port is used to load a 12-bit-wide word into either of the two DACs. This port, whose data loading is similar to that of a RAM's write cycle, interfaces directly with most 12-bit or wider bus systems. With WR and CS lines at logic LOW, the input data registers are transparent. This allows direct unbuffered data to flow directly to the DAC output selected by DAC A/DAC B control input.
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DAC8221
Documentation
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8967101LA |
24-Lead CerDIP (Narrow 0.3 Inch)
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| DAC8221AW/883C |
24-Lead CerDIP (Narrow 0.3 Inch)
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| DAC8221FPZ |
24-Lead PDIP
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| DAC8221FSZ |
24-Lead SOIC (Wide)
|
|
|
| DAC8221GPZ |
24-Lead PDIP
|
|
- 5962-8967101LA
- Pin/Package Drawing
-
24-Lead CerDIP (Narrow 0.3 Inch)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC8221AW/883C
- Pin/Package Drawing
-
24-Lead CerDIP (Narrow 0.3 Inch)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC8221FPZ
- Pin/Package Drawing
-
24-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC8221FSZ
- Pin/Package Drawing
-
24-Lead SOIC (Wide)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC8221GPZ
- Pin/Package Drawing
-
24-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
DAC8221FSZ
PRODUCTION
Jul 31, 2009
- 09_0106
Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
DAC8221FPZ
PRODUCTION
DAC8221GPZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC8221FPZ
PRODUCTION
DAC8221GPZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
DAC8221FSZ
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
DAC8221FSZ
PRODUCTION
Jul 31, 2009
- 09_0106
Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
5962-8967101LA
PRODUCTION
DAC8221AW/883C
PRODUCTION
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
DAC8221FPZ
PRODUCTION
DAC8221GPZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC8221FPZ
PRODUCTION
DAC8221GPZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
Tools & Simulations 1
Precision DAC Error Budget Tool
