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- Improved Resistance to ESD
- Minimizes Address-Decoding in Multiple DAC Systems—Three-Wire Interface for Any Number of DACs:
One Data Line
One CLK Line
One Load Line
- Fast, Flexible, Microprocessor Interfacing in Serially Controlled systems
- Buffered Digital Output Pin for Daisy-Chaining Multiple DACs
- -40°C to +85°C for the Extended Industrial Temperature Range
The DAC8143 is a 12-bit serial-input, daisy-chain digital-to-analog converter. It was designed for multiple serial DAC systems where serial daisy-chaining one DAC after another is greatly simplified. The daisy chain feature saves address-decoding lines enabling simpler logic interfacing in multiple package DAC designs.
The DAV8143 is ideal for data acquisition and process control systems offering the user a wide flexibility in output voltage ranges through choices of external references and output I-to-V converter op amps.
Serial data in the input register (MSB first) is sequentially clocked out to the SRO pin as the new data word (MSB first) is simultaneously clocked in from the SRI pin. The strobe inputs are used to clock in/out data on the rising or falling (user selected) strobe edges (STB1, STB2, STB3, STB4).
When the shift register’s data has been updated, the new data word is transferred to the DAC register with use of LD1 and LD2 inputs.
Separate LOAD control inputs allow simultaneous output updating of multiple DACs. An asynchronous CLEAR input resets the DAC register without altering data in the input register.
Improved linearity and gain error performance permits reduced circuit parts count through the elimination of trimming components. Fast interface timing reduces timing design considerations while minimizing microprocessor wait states.
The DAC8143 is available in plastic packages that are compatible with autoinsertion equipment.
Plastic packaged devices come in the extended industrial temperature range of –40°C to +85°C.
APPLICATIONS
- Multiple-Channel Data Acquisition Systems
- Process Control and Industrial Automation
- Test Equipment
- Remote Microprocessor-Controlled Systems
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Documentation
Solutions Bulletin & Brochure 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
DAC8143FPZ | 16-Lead PDIP |
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DAC8143FSZ | 16-Lead SOIC Wide |
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DAC8143FSZ-REEL | 16-Lead SOIC Wide |
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- DAC8143FPZ
- Pin/Package Drawing
- 16-Lead PDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- DAC8143FSZ
- Pin/Package Drawing
- 16-Lead SOIC Wide
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- DAC8143FSZ-REEL
- Pin/Package Drawing
- 16-Lead SOIC Wide
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
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Part Models
Product Lifecycle
PCN
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
DAC8143FPZ
PRODUCTION
DAC8143FSZ
PRODUCTION
DAC8143FSZ-REEL
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC8143FPZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
DAC8143FSZ
PRODUCTION
DAC8143FSZ-REEL
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
DAC8143FPZ
PRODUCTION
DAC8143FSZ
PRODUCTION
DAC8143FSZ-REEL
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC8143FPZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
DAC8143FSZ
PRODUCTION
DAC8143FSZ-REEL
PRODUCTION