DAC312
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DAC312

12-Bit High Speed Multiplying D/A Converter

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Part Details
Part Models 5
1ku List Price Starting From $7.65
Features
  • Differential Nonlinearity: ±1/2 LSB
  • Nonlinearity: 0.05%
  • Fast Settling Time: 250 ns
  • High Compliance: -5 V to +10 V
  • Differential Outputs: 0 to 4 mA
  • Guaranteed Monotonicity: 12 bits
  • Low Full-Scale Tempco: 10 ppm/°C
  • Circuit Interface to TTL, CMOS, ECL, PMOS/NMOS
  • Low Power Consumption: 225 mW
  • Industry Standard AM6012 Pinout
  • Available in Die Form
Additional Details
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The DAC312 series of 12-bit multiplying digital-to-analog converters provide high speed with guaranteed performance to 0.012% differential nonlinearity over the full commercial operating temperature range.

The DAC312 combines a 9-bit master D/A converter with a 3-bit (MSBs) segment generator to form an accurate 12-bit D/A converter at low cost. This technique guarantees a very uniform step size (up to ±1/2 LSB from the ideal), monotonicity to 12-bits and integral nonlinearity to 0.05% at its differential current outputs. In order to provide the same performance with a 12-bit R-2R ladder design, an integral nonlinearity over temperature of 1/2 LSB (0.012%) would be required.

The 250 ns settling time with low glitch energy and low power consumption are achieved by careful attention to the circuit design and stringent process controls. Direct interface with all popular logic families is achieved through the logic threshold terminal.

High compliance and low drift characteristics (as low as 10 ppm/°C) are also features of the DAC312 along with an excellent power supply rejection ratio of ±.001% FS/%∆V. Operating over a power supply range of +5/–11 V to ±18 V the device consumes 225 mW at the lower supply voltages with an absolute maximum dissipation of 375 mW at the higher supply levels.

With their guaranteed specifications, single chip reliability and low cost, the DAC312 device makes excellent building blocks for A/D converters, data acquisition systems, video display drivers, programmable test equipment and other applications where low power consumption and complete input/output versatility are required.

Part Models 5
1ku List Price Starting From $7.65

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
DAC312ER
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DAC312FR
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DAC312HPZ
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DAC312HSZ
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DAC312HSZ-REEL
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Product Lifecycle

PCN

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

DAC312ER

PRODUCTION

DAC312FR

PRODUCTION

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

DAC312ER

PRODUCTION

DAC312FR

PRODUCTION

DAC312HPZ

PRODUCTION

DAC312HSZ

PRODUCTION

DAC312HSZ-REEL

PRODUCTION

Mar 7, 2019

- 19_0046

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Nov 10, 2015

- 15_0207

Addition of a Polyimide Layer for DAC312

DAC312HPZ

PRODUCTION

DAC312HSZ

PRODUCTION

DAC312HSZ-REEL

PRODUCTION

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Aug 4, 2010

- 10_0117

Halogen Free Material Change for SOIC_W Products at Carsem

DAC312HSZ

PRODUCTION

DAC312HSZ-REEL

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

DAC312ER

PRODUCTION

DAC312FR

PRODUCTION

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

DAC312ER

PRODUCTION

DAC312FR

PRODUCTION

DAC312HPZ

PRODUCTION

DAC312HSZ

PRODUCTION

DAC312HSZ-REEL

PRODUCTION

Mar 7, 2019

- 19_0046

arrow down

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Nov 10, 2015

- 15_0207

arrow down

Addition of a Polyimide Layer for DAC312

DAC312HPZ

PRODUCTION

DAC312HSZ

PRODUCTION

DAC312HSZ-REEL

PRODUCTION

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Aug 4, 2010

- 10_0117

arrow down

Halogen Free Material Change for SOIC_W Products at Carsem

DAC312HSZ

PRODUCTION

DAC312HSZ-REEL

PRODUCTION

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