DAC10
10-Bit High Speed Multiplying D/A Converter (Universal Digital Logic Interface)
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Features
- Fast Settling: 85 ns
- Low Full-Scale Drift: 10 ppm/°C
- Nonlinearity to 0.05% Max Over Temperature Range
- Complementary Current Outputs: 0 mA to 4 mA
- Wide Range Multiplying Capability:
- 1 MHz Bandwidth
- Wide Power Supply Range:
- +5, -7.5 Min to ±18 V Max
- Direct Interface to TTL, CMOS,
- ECL, PMOS, NMOS
- Availability to DIE Form
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The DAC10 series of 10-bit monolithic multiplying digital-to-analog converters provide high speed performance and full-scale accuracy. Advanced circuit design achieves 85 ns settling times with very low "glitch" energy and low power consumption. Direct interface to all popular logic families with full noise immunity is provided by the high swing, adjustable threshold logic inputs.
All DAC10 series models guarantee full 10-bit monotonicity, and nonlinearities as tight as +0.05% over the entire operating temperature range are available. Device performance is essentially unchanged over the ±18 V power supply range, with 85 mW power consumption attainable at lower supplies.
A highly stable, unique trim method is used, which selectively shorts Zener diodes, to provide 1/2 LSB full-scale accuracy without the need for laser trimming.
Single-chip reliability, coupled with low cost and outstanding flexibility, make the DAC10 device an ideal building block for A/D converters, Data Acquisition systems, CRT displays, programmable test equipment and other applications where low power consumption, input/output versatility and long-term stability are required.
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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Documentation
Solutions Bulletin & Brochure 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| DAC10FX |
18-Lead CerDIP
|
|
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| DAC10GBCG:69 | CHIPS OR DIE |
|
|
| DAC10GPZ |
18-Lead PDIP
|
|
|
| DAC10GSZ |
18-Lead SOIC (Wide)
|
|
|
| DAC10GSZ-REEL |
18-Lead SOIC (Wide)
|
|
|
| DAC10NBCG:69 | CHIPS OR DIE |
|
|
| DAC10NTBCG:69 | CHIPS OR DIE |
|
- DAC10FX
- Pin/Package Drawing
-
18-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC10GBCG:69
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC10GPZ
- Pin/Package Drawing
-
18-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC10GSZ
- Pin/Package Drawing
-
18-Lead SOIC (Wide)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC10GSZ-REEL
- Pin/Package Drawing
-
18-Lead SOIC (Wide)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC10NBCG:69
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC10NTBCG:69
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
DAC10FX
DAC10GPZ
PRODUCTION
DAC10GSZ
PRODUCTION
DAC10GSZ-REEL
PRODUCTION
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC10GPZ
PRODUCTION
Sep 9, 2022
- 22_0148
Assembly Site Transfer for 18L SOIC_W Products
DAC10GSZ
PRODUCTION
DAC10GSZ-REEL
PRODUCTION
Feb 7, 2011
- 10_0003
Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor
DAC10GSZ
PRODUCTION
DAC10GSZ-REEL
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
DAC10FX
DAC10GPZ
PRODUCTION
DAC10GSZ
PRODUCTION
DAC10GSZ-REEL
PRODUCTION
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC10GPZ
PRODUCTION
Sep 9, 2022
- 22_0148
Assembly Site Transfer for 18L SOIC_W Products
DAC10GSZ
PRODUCTION
DAC10GSZ-REEL
PRODUCTION
Feb 7, 2011
- 10_0003
Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor
DAC10GSZ
PRODUCTION
DAC10GSZ-REEL
PRODUCTION
