ADSD3030

RECOMMENDED FOR NEW DESIGNS

VGA, CMOS, Time of Flight, Backside Illumination Sensor

Data Sheet (Rev. SpA) Product Selection Table

Part Models: 2
1ku List Price: price unavailable

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Overview

512 (horizontal) × 640 (vertical) pixel array
3.5 μm × 3.5 μm square pixels
1/6 inch optical format
4-wire SPI or 2-wire I²C serial interface

MIPI CSI-2 transmitter interface with support for 1 or 2 data lanes, programmable up to 2.5 Gbps per lane
Dual, 3.3 V and 1.2 V external supplies, 1.8 V input and output section
Die size: 3.749 mm± 0.01 mm × 6.4544 mm ± 0.01 mm

The ADSD3030 is a CMOS 3D Time of Flight (ToF)-based 3D depth and 2D visual light imager that is available for integration into 3D sensor systems. The functional blocks required for read out, which include analog-to-digital converters (ADCs), amplifiers, pixel biasing circuitry, and sensor control logic, are built into the chip to enable a cost-effective and simple implementation into systems.

The ADSD3030 interfaces electrically to a host system over a mobile industry processor interface (MIPI), Camera Serial Interface 2 (CSI-2) interface. A lens plus optical band-pass filter for the imager and an infrared light source plus an associated driver are required to complete the working subsystem.

APPLICATIONS

Smartphones
Augmented reality (AR) and virtual reality (VR)
Machine vision systems (logistics and inventory)
Robotics (consumer and industrial)

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

ADSD3030: VGA, CMOS, Time of Flight, Backside Illumination Sensor Data Sheet (Rev.SpA) 09/22/2023

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADSD3030K-DF	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADSD3030K-DF-8	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

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