1. Products
  2. RF and Microwave
  3. RF Mixers
  4. RF Mixers with Integrated LO
  5. ADRF6650


Features and Benefits

  • Dual down-converter with integrated fractional-N PLL/VCO
  • RF: 450 MHz to 2700 MHz continuous
  • LO frequency: 450 MHz to 2900 MHz, high-side or low-side injection
  • 43 dB gain control range
  • Gain control with up/down and SPI
  • Integrated RF balun for single-ended 50 Ω inputs
  • Power supply: 3.3 and 5 V
  • 8 mm × 8 mm, 56-lead LFCSP package

Product Details

The ADRF6650 is a highly integrated downconverter that integrates dual mixers, dual digital switched attenuators, dual digital variable gain amplifiers, a phase-locked loop (PLL), and voltage controlled oscillators (VCOs). In addition, the ADRF6650 integrates two radio frequency (RF) baluns, serial gain control (SGC) controls, and fast enable inputs for time division duplex (TDD) operation.

The on-chip RF baluns enable the ADRF6650 to support 50 Ω terminated RF inputs. The integrated passive mixer provides a highly linear downconversion for a 200 MHz, sliding, intermediate frequency (IF) window. The ADRF6650 uses broadband square wave limiting local oscillator (LO) amplifiers to achieve an RF bandwidth of 450 MHz to 2700 MHz. Unlike conventional narrow-band sine wave LO amplifier solutions, this amplifier permits the LO to be applied either above or below the RF input over an extremely wide bandwidth.

The ADRF6650 offers two alternatives for generating the differential LO input signal: internally via the on-chip fractional-N synthesizer with low phase noise VCOs, or externally via a low phase noise LO signal. The integrated PLL/VCO enables continuous LO coverage from 450 MHz to 2900 MHz. The PLL reference input supports a wide frequency range and includes integrated reference dividers before the phase frequency detector (PFD).

The ADRF6650 is fabricated using an advanced silicon-germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS) process. It is available in a 56-lead, RoHS-compliant, 8 mm × 8 mm, lead frame chip scale package (LFCSP) package with an exposed pad. Performance is specified over the −40°C to +105°C maximum paddle temperature.


  • Multiband/multistandard cellular base station diversity receivers
  • Wideband radio link diversity downconverters
  • Multimode cellular extenders and picocells

Product Lifecycle icon-recommended Recommended for New Designs

This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.

Evaluation Kits (1)

Design Resources

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
ADRF6650ACPZ Material Declaration Reliability Data 56-Lead LFCSP (8mm x 8mm x 0.75mm w/ EP)
ADRF6650ACPZ-RL7 Material Declaration Reliability Data 56-Lead LFCSP (8mm x 8mm x 0.75mm w/ EP)
Wafer Fabrication Data

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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.