ADRF5424

RECOMMENDED FOR NEW DESIGNS

Die on Carrier, Silicon SPDT Switch, 100 MHz to 60 GHz

Data Sheet (Rev. B) Product Selection Table

Part Models: 3
1ku List Price: price unavailable

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Overview

Ultrawideband frequency range: 100 MHz to 60 GHz
Reflective design
Bond pads for wire bond and ribbon bond
Low insertion loss

1.0 dB typical up to 18 GHz
1.3 dB typical up to 44 GHz
1.5 dB typical up to 55 GHz

High input linearity

P1dB: 28 dBm typical
IP3: 50 dBm typical

High RF power handling

Through path: 27 dBm up to 40 GHz
Hot switching: 27 dBm up to 40 GHz

No low frequency spurious signals
RF settling time (50% V_CTRL to 0.1 dB of final RF output): 17 ns
14-pad, 2.571 mm x 2.471 mm, die on carrier [CHIP]

The ADRF5424 is a reflective, single-pole double-throw (SPDT) switch manufactured in a silicon process attached on a gallium arsenide (GaAs) carrier substrate. The substrate incorporates the bond pads for chip and wire assembly, and the bottom of the device is metalized, connected to ground.

This device operates from 100 MHz to 60 GHz with better than 1.5 dB of insertion loss and 35 dB of isolation at 55 GHz. The ADRF5424 has an RF input power handling capability of 27 dBm up to 40 GHz for both the through path and hot switching.

The ADRF5424 draws a low current of 14 μA on the positive supply of +3.3 V and 120 μA on negative supply of −3.3 V. The device features complementary metal-oxide semiconductor (CMOS)-/low voltage transistor to transistor logic (LVTTL)-compatible controls.

The ADRF5424 is designed to match a characteristic impedance of 50 Ω.

Applications

Test and instrumentation

Cellular infrastructure: 5G mmWave

Military radios, radars, and electronic counter measures (ECMs)

Microwave radios and very small aperture terminals (VSATs)

Part Models: 3
1ku List Price: price unavailable

Documentation

Data Sheet 1

ADRF5424: Die on Carrier, Silicon SPDT Switch, 100 MHz to 60 GHz Data Sheet (Rev.B) 08/25/2023

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADRF5424BCZ	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADRF5424BCZ-GP	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADRF5424BCZ-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

S-Parameter 1

ADRF5424 S-Parameters

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