ADRF5132
Info : RECOMMENDED FOR NEW DESIGNS
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ADRF5132

High Power, 20 W Peak, Silicon SPDT, Reflective Switch, 0.7 GHz to 5.0 GHz

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 2
1ku List Price Starting From $13.59
Features
  • Reflective, 50 Ω design
  • Low insertion loss: 0.6 dB typical at 2.7 GHz
  • High power handling at TCASE = 105°C
    • Long-term (>10 years operation)
      • Peak power: 43 dBm
      • CW power: 38 dBm
      • LTE power average (8 dB PAR): 35 dBm
  • Single event (<10 sec operation)
    • LTE power average (8 dB PAR): 41 dBm
  • High linearity
    • P0.1dB: 42.5 dBm typical
    • IP3: 65 dBm typical at 2.0 GHz to 4.0 GHz
  • ESD ratings
    • HBM: 2 kV, Class 2
    • CDM: 1.25 kV
  • Single positive supply: 5 V
  • Positive control, CMOS/TTL compatible
  • 16-lead, 3 mm × 3 mm LFCSP package
Additional Details
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The ADRF5132 is a high power, reflective, 0.7 GHz to 5.0 GHz, silicon, single-pole, double-throw (SPDT) reflective switch in a leadless, surface-mount package. The switch is ideal for high power and cellular infrastructure applications, like long-term evolution (LTE) base stations. The ADRF5132 has high power handling of 35 dBm LTE (average typical at 105°C), a low insertion loss of 0.6 dB at 2.7 GHz, input third-order intercept of 65 dBm (typical), and 0.1 dB compression (P0.1dB) of 42.5 dBm.

The on-chip circuitry operates at a single, positive supply voltage of 5 V and a typical supply current of 1.1 mA typical, making the ADRF5132 an ideal alternative to pin diode-based switches.

The device is in a RoHS compliant, compact, 16-lead, 3 mm × 3 mm LFCSP package.

Applications

  • Cellular/4G infrastructure
  • Wireless infrastructure
  • Military and high reliability applications
  • Test equipment
  • Pin diode replacement
Part Models 2
1ku List Price Starting From $13.59

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Documentation

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Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADRF5132BCPZN
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ADRF5132BCPZN-R7
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Product Lifecycle

PCN

May 3, 2018

- 18_0083

ADRF5132 Data Sheet Change for Pin Functions

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Part Models

Product Lifecycle

PCN

May 3, 2018

- 18_0083

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ADRF5132 Data Sheet Change for Pin Functions

Software & Part Ecosystem

Evaluation Kits 1

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EVAL-ADRF5132

ADRF5132 Evaluation Board

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EVAL-ADRF5132

ADRF5132 Evaluation Board

ADRF5132 Evaluation Board

Product Detail

The ADRF5132-EVALZ can handle high power levels and temperatures at which the device operates.


The ADRF5132-EVALZ evaluation board is constructed with eight metal layers and dielectrics between each layer. Each metal layer has 1 oz (1.3 mil) copper thickness, whereas the external layers are 1.5 oz.


The top dielectric material is 10 mil Rogers RO4350, which exhibits a very low thermal coefficient, offering control over thermal rise of the board. The dielectrics between other metal layers are FR4. The overall board thickness achieved is 60 mil.

Resources

Tools & Simulations 2

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