ADPA9007-2

RECOMMENDED FOR NEW DESIGNS

DC to 28 GHz, GaAs, pHEMT, 2 W Power Amplifier

Data Sheet (Rev. 0) Product Selection Table

Part Models: 2
1ku List Price: price unavailable

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Overview

Wideband, internally matched, RF power amplifier
DC-coupled input and output
Integrated RF power detector
Integrated temperature sensor

Gain: 13 dB typical at 8 GHz to 16 GHz
OP1dB: 32.5 dBm typical at 8 GHz to 16 GHz
P_SAT: 33.5 dBm typical at 8 GHz to 16 GHz
OIP3: 43.5 dBm typical at 8 GHz to 16 GHz

The ADPA9007-2CHIP is a 2 W, RF power amplifier that operates from DC to 28 GHz. The RF input and output are internally matched and DC-coupled. The ADPA9007-2CHIP includes an integrated temperature-compensated RF power detector and an integrated temperature sensor.

The ADPA9007-2CHIP amplifier provides a gain of 13 dB, an output power for 1 dB compression (OP1dB) of 32.5 dBm, and an output third-order intercept (OIP3) of 43.5 dBm from 8 GHz to 16 GHz. The amplifier operates from a typical supply voltage (V_DD) of 15 V and has a 500 mA typical quiescent drain current (I_DQ), which is adjustable.

The ADPA9007-2CHIP is fabricated on a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT) process and is specified for operation from −55°C to +85°C.

APPLICATIONS

Electronic warfare
Radar
Test and measurement equipment

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

ADPA9007-2: DC to 28 GHz, GaAs, pHEMT, 2 W Power Amplifier Data Sheet (Rev.0) 04/30/2024

Application Note 1

AN-2591: When It Comes to Long-Term Reliability of RF Amplifier ICs, Focus First on Die Junction Temperature 08/05/2024

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADPA9007-2C-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADPA9007-2CHIP	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

S-Parameter 1

ADPA9007-2 S-Parameters

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