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ADPA7008: 20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 31 dBm (1 W) Power Amplifier Data Sheet (Rev. 0)7/30/2021PDF2 M
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ADPA7008CHIP Data Sheet (Rev. 0)3/24/2021PDF396 K
ADPA7008
20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 31 dBm (1 W) Power Amplifier
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Overview
Features and Benefits
ADPA7008 Chip Features
- Output P1dB: 30.5 dBm typical at 22 GHz to 42 GHz
- PSAT: 31 dBm typical at 22 GHz to 42 GHz
- Gain: 18 dB typical at 22 GHz to 42 GHz
- Input return loss: 22 dB typical at 22 GHz to 42 GHz
- Output return loss: 23 dB typical at 22 GHz to 42 GHz
- Output IP3: 38 dBm typical at 22 GHz to 42 GHz
- Supply voltage: 5 V typical at 1500 mA
- 50 Ω matched input and output
- Die size: 3.610 mm × 3.610 mm × 0.102 mm
ADPA7008AEHZ Features
- Output P1dB: 30 dBm typical at 22 GHz to 40 GHz
- PSAT: 31 dBm typical at 22 GHz to 40 GHz
- Gain: 17.5 dB typical at 22 GHz to 40 GHz
- Input return loss: 12 dB typical at 22 GHz to 40 GHz
- Output return loss: 9.5 dB typical at 22 GHz to 40 GHz
- Output IP3: 37 dBm typical at 22 GHz to 40 GHz
- Supply voltage: 5 V typical at 1500 mA
- 50 Ω matched input and output
- 18-terminal, 7 mm × 7 mm, ceramic leadless chip carrier with heat sink [LCC_HS]
- Integrated power detector
Product Details
The ADPA7008CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 31 dBm saturated output power (1 W) distributed power amplifier that operates from 20 GHz to 54 GHz. The amplifier provides a gain of 18 dB, an output power for 1 dB compression (P1dB) of 30.5 dBm, and a typical output third-order intercept (IP3) of 38 dBm at 22 GHz to 42 GHz. The ADPA7008CHIP requires 1500 mA from a 5 V supply voltage (VDD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the RFIN and RFOUT pads connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length.
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Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
Documentation & Resources
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RF, Microwave, and Millimeter Wave Product Selection Guide7/13/2018PDF9M
Tools & Simulations
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| ADPA7008AEHZ | Material Declaration | Reliability Data | 18-Lead LCC (7mm x 7mm x 1.32mm w/EP) | |
| ADPA7008AEHZ-R7 | Material Declaration | Reliability Data | 18-Lead LCC (7mm x 7mm x 1.32mm w/EP) | |
| ADPA7008C-KIT | Material Declaration | Reliability Data | CHIPS OR DIE | |
| ADPA7008CHIP | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
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ADPA7008 Discussions
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Buy Now Pricing
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List Pricing
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Lead Times
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Evaluation Boards
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.