ADPA7008
Info : RECOMMENDED FOR NEW DESIGNS
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ADPA7008

20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 31 dBm (1 W) Power Amplifier

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 4
1ku List Price Starting From $227.13
Features

ADPA7008 Chip Features

  • Output P1dB: 30.5 dBm typical at 22 GHz to 42 GHz
  • PSAT: 31 dBm typical at 22 GHz to 42 GHz
  • Gain: 18 dB typical at 22 GHz to 42 GHz
  • Input return loss: 22 dB typical at 22 GHz to 42 GHz
  • Output return loss: 23 dB typical at 22 GHz to 42 GHz
  • Output IP3: 38 dBm typical at 22 GHz to 42 GHz
  • Supply voltage: 5 V typical at 1500 mA
  • 50 Ω matched input and output
  • Die size: 3.610 mm × 3.610 mm × 0.102 mm

ADPA7008AEHZ Features

  • Output P1dB: 30 dBm typical at 22 GHz to 40 GHz
  • PSAT: 31 dBm typical at 22 GHz to 40 GHz
  • Gain: 17.5 dB typical at 22 GHz to 40 GHz
  • Input return loss: 12 dB typical at 22 GHz to 40 GHz
  • Output return loss: 9.5 dB typical at 22 GHz to 40 GHz
  • Output IP3: 37 dBm typical at 22 GHz to 40 GHz
  • Supply voltage: 5 V typical at 1500 mA
  • 50 Ω matched input and output
  • 18-terminal, 7 mm × 7 mm, ceramic leadless chip carrier with heat sink [LCC_HS]
  • Integrated power detector
Additional Details
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The ADPA7008CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 31 dBm saturated output power (1 W) distributed power amplifier that operates from 20 GHz to 54 GHz. The amplifier provides a gain of 18 dB, an output power for 1 dB compression (P1dB) of 30.5 dBm, and a typical output third-order intercept (IP3) of 38 dBm at 22 GHz to 42 GHz. The ADPA7008CHIP requires 1500 mA from a 5 V supply voltage (VDD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the RFIN and RFOUT pads connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length.

APPLICATIONS

  • Military and space
  • Test instrumentation
  • Satellite communications
  • Part Models 4
    1ku List Price Starting From $227.13

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    Documentation

    Documentation

    Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
    ADPA7008AEHZ
    • HTML
    • HTML
    ADPA7008AEHZ-R7
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    • HTML
    ADPA7008C-KIT
    • HTML
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    ADPA7008CHIP
    • HTML
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    Software & Part Ecosystem

    Software & Part Ecosystem

    Evaluation Kit

    Evaluation Kits 1

    reference details image

    EVAL-ADPA7008

    Evaluating the ADPA7008 20 GHz to 54 GHz, GaAs, pHEMT, 31 dBm (1 W) Power Amplifier

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    EVAL-ADPA7008

    Evaluating the ADPA7008 20 GHz to 54 GHz, GaAs, pHEMT, 31 dBm (1 W) Power Amplifier

    Evaluating the ADPA7008 20 GHz to 54 GHz, GaAs, pHEMT, 31 dBm (1 W) Power Amplifier

    Features and Benefits

  • 2-layer Rogers 4350B evaluation board with heat spreader
  • End launch 1.85 mm RF connectors
  • Through calibration path
  • Product Detail

    The ADPA7008-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA7008 as well as mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 1.85 mm female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA7008-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA7008.

    RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat spreader.

    The power supply decoupling capacitors shown in the Figure 4 of the user guide represent the configuration that was used to characterize and qualify the device. It is possible to reduce the number of capacitors; however, this reduction varies by system. It is instead recommended to first remove or combine the largest capacitors that are farthest from the device.

    Consult the ADPA7008 data sheet in conjunction with the user guide when working with the ADPA7008-EVALZ board.

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