ADPA7008

RECOMMENDED FOR NEW DESIGNS

20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 31 dBm (1 W) Power Amplifier

Data Sheet (Rev. A) Product Selection Table

Part Models: 4
1ku List Price: Starting From $227.13

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Overview

ADPA7008 Chip Features

Output P1dB: 30.5 dBm typical at 22 GHz to 42 GHz
P_SAT: 31 dBm typical at 22 GHz to 42 GHz
Gain: 18 dB typical at 22 GHz to 42 GHz
Input return loss: 22 dB typical at 22 GHz to 42 GHz
Output return loss: 23 dB typical at 22 GHz to 42 GHz
Output IP3: 38 dBm typical at 22 GHz to 42 GHz
Supply voltage: 5 V typical at 1500 mA
50 Ω matched input and output
Die size: 3.610 mm × 3.610 mm × 0.102 mm

ADPA7008AEHZ Features

Output P1dB: 30 dBm typical at 22 GHz to 40 GHz
P_SAT: 31 dBm typical at 22 GHz to 40 GHz
Gain: 17.5 dB typical at 22 GHz to 40 GHz
Input return loss: 12 dB typical at 22 GHz to 40 GHz
Output return loss: 9.5 dB typical at 22 GHz to 40 GHz
Output IP3: 37 dBm typical at 22 GHz to 40 GHz
Supply voltage: 5 V typical at 1500 mA
50 Ω matched input and output
18-terminal, 7 mm × 7 mm, ceramic leadless chip carrier with heat sink [LCC_HS]
Integrated power detector

The ADPA7008CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 31 dBm saturated output power (1 W) distributed power amplifier that operates from 20 GHz to 54 GHz. The amplifier provides a gain of 18 dB, an output power for 1 dB compression (P1dB) of 30.5 dBm, and a typical output third-order intercept (IP3) of 38 dBm at 22 GHz to 42 GHz. The ADPA7008CHIP requires 1500 mA from a 5 V supply voltage (V_DD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the RFIN and RFOUT pads connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length.

APPLICATIONS

Military and space

Test instrumentation

Satellite communications

Part Models: 4
1ku List Price: Starting From $227.13

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADPA7008AEHZ	18-Lead LCC (7mm x 7mm x 1.32mm w/EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADPA7008AEHZ-R7	18-Lead LCC (7mm x 7mm x 1.32mm w/EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADPA7008C-KIT	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADPA7008CHIP	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

S-Parameter 2

Evaluation Kits

Evaluating the ADPA7008 20 GHz to 54 GHz, GaAs, pHEMT, 31 dBm (1 W) Power Amplifier

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Features and Benefits

2-layer Rogers 4350B evaluation board with heat spreader

End launch 1.85 mm RF connectors

Through calibration path

Product Details

The ADPA7008-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA7008 as well as mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 1.85 mm female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA7008-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA7008.

RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat spreader.

The power supply decoupling capacitors shown in the Figure 4 of the user guide represent the configuration that was used to characterize and qualify the device. It is possible to reduce the number of capacitors; however, this reduction varies by system. It is instead recommended to first remove or combine the largest capacitors that are farthest from the device.

Consult the ADPA7008 data sheet in conjunction with the user guide when working with the ADPA7008-EVALZ board.

Resources

ADPA7008 Gerber Files
1/18/2022

UG-2003: Evaluating the ADPA7008 20 GHz to 54 GHz, GaAs, pHEMT, 31 dBm (1 W) Power Amplifier (Rev.0)
7/30/2021

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