ADPA7007
GaAs, pHEMT, MMIC,1 W Power Amplifier, 18 GHz to 44 GHz
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Features
- Output P1dB: 31 dBm typical at 22 GHz to 36 GHz
- PSAT: 32 dBm typical at 22 GHz to 36 GHz
- Gain: 21.5 dB typical at 22 GHz to 36 GHz
- Output IP3: 41 dBm typical at 22 GHz to 44 GHz
- Supply voltage: 5 V typical at 1400 mA maximum
- 50 Ω matched input and output
- Die size: 3.610 mm × 3.610 mm × 0.102 mm
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The ADPA7007CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), distributed power amplifier that operates from 18 GHz to 44 GHz. The amplifier provides a gain of 21.5 dB, an output power for 1 dB compression (P1dB) of 31 dBm, and a typical output thirdorder intercept (IP3) of 41 dBm. The ADPA7007CHIP requires 1400 mA from a 5 V supply on the supply voltage (VDD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data was taken with the chip connected via two 0.025 mm wire bonds that are at least 0.31 mm long.
Applications
- Military and space
- Test instrumentation
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ADPA7007
Documentation
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Data Sheet
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ADPD7007: 20 GHz to 44 GHz, GaAs, pHEMT, 31.5 dBm (>1 W), MMIC Power Amplifier Data Sheet (Rev.0)
ADPD7007: 20GHz～44GHz、GaAs pHEMT、31.5dBm（>1W）MMIC パワー・アンプ データシート
User Guide
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Evaluation Design File
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Data Sheet 2
User Guide 1
Application Note 2
Evaluation Design File 1
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADPA7007AEHZ |
18-Lead LCC (7mm x 7mm x 1.32mm w/EP)
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| ADPA7007AEHZ-R7 |
18-Lead LCC (7mm x 7mm x 1.32mm w/EP)
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| ADPA7007C-KIT | CHIPS OR DIE |
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| ADPA7007CHIP | CHIPS OR DIE |
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- ADPA7007AEHZ
- Pin/Package Drawing
-
18-Lead LCC (7mm x 7mm x 1.32mm w/EP)
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADPA7007AEHZ-R7
- Pin/Package Drawing
-
18-Lead LCC (7mm x 7mm x 1.32mm w/EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADPA7007C-KIT
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- ADPA7007CHIP
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Software & Part Ecosystem
Evaluation Kits 1
EVAL-ADPA7007
ADPA7007 Evaluation Board
Product Detail
The ADPA7007-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat sink. The ADPA7007-EVALZ uses the same PCB as the ADPA7005-EVALZ but with the ADPA7007 populated on the board. The heat sink assists in providing thermal relief to the ADPA7007 as well as mechanical support to the PCB. Mounting holes on the heat sink allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device.
RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.
The power supply decoupling capacitors on the evaluation board represent the configuration that was used to characterize and qualify the device. The number of capacitors can be reduced but this scope varies from system to system. The general guidance is to first remove or combine the largest capacitors that are farthest from the device.
Consult the ADPA7007 data sheet in conjunction with this user guide when working with the ADPA7007-EVALZ board.
Resources
Evaluation Kits1
Tools & Simulations 1
S-Parameter 2
S-Parameter
