Features and Benefits
- Output P1dB: up to 31 dBm typical
- PSAT: up to 32 dBm typical
- Gain: up to 15.5 dB typical
- Output IP3: up to 42.5 dBm typical
- Supply voltage: 5 V at 1400 mA
- 50 Ω matched input/output
- 18-terminal, 7 mm × 7 mm LCC_HS package
- Integrated power detector
- Output P1dB: 31 dBm typical at 20 GHz to 34 GHz
- PSAT: 32 dBm typical at 20 GHz to 34 GHz
- Gain: 17 dB typical at 20 GHz to 34 GHz
- Output IP3: 41 dBm typical at 20 GHz to 34 GHz
- Supply voltage: 5 V at 1200 mA maximum
- 50 Ω matched input/output
- Die size: 3.75 mm × 3.47 mm × 0.1 mm
The ADPA7005 is a gallium arsenide (GaAs), pseudomorphic high electron mobility transfer (pHEMT), monolithic microwave integrated circuit (MMIC), 32 dBm saturated output power (PSAT), >1 W, power amplifier, with an integrated temperature compensated, on-chip power detector that operates between 18 GHz and 44 GHz. The ADPA7005 provides 15.5 dB of small signal gain and approximately 32 dBm of PSAT at 32 GHz from a 5 V supply (see Figure 26 in the data sheet). The ADPA7005 has an output IP3 of 40 dBm between 24 GHz to 34 GHz and is ideal for linear applications such as electronic countermeasure and instrumentation applications requiring >30 dBm of efficient PSAT. The RF input and outputs are internally matched and dc blocked for ease of integration into higher level assemblies. The ADPA7005 is packaged in a 7 mm × 7 mm, 18‑terminal ceramic leadless chip carrier with heat sink (LCC_HS) that exhibits low thermal resistance and is compatible with surface-mount manufacturing techniques.
The ADPA7005CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), distributed power amplifier that operates from 20 GHz to 44 GHz. The amplifier provides 17 dB of small signal gain, 31 dBm output power for 1 dB compression (P1dB), and a typical output third-order intercept (IP3) of 41 dBm. The ADPA7005CHIP requires 1200 mA from a 5 V supply on the supply voltage (VDD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the chip connected via two 0.025 mm wire bonds that are at least 0.31 mm long.
- Military and space
- Test instrumentation
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The ADPA7005-EVALZ consists of a two-layer printed circuit board (PCB) fabricated from a 10 mil thick, Rogers 4350B, copper clad mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports on the ADPA7005-EVALZ are populated by 2.9 mm, female coaxial connectors. The respective RF traces have a 50 Ω characteristic impedance.
The ADPA7005-EVALZ is populated with components suitable for use over the entire −40°C to +85°C operating temperature range of the device. To calibrate board trace losses, a through calibration path is provided between the J1 and the J2 connectors. J1 and J2 must be populated with RF connectors to use the through calibration path. See Table 2 and Figure 3 for the through calibration path performance.
The power voltages, ground voltages, gate control voltages, and detector output voltages are accessed through two 8-pin headers (see Table 1 in the user guide).
The RF traces are 50 Ω, grounded, coplanar waveguide. Package ground leads and the exposed paddle connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.
The power supply decoupling capacitors on the ADPA7005-EVALZ represent the configuration that was used to characterize and qualify the device. There may be a scope to reduce the number of capacitors, but the scope varies from system to system. It is recommended to first remove or combine the largest capacitors that are farthest from the device.
Features & Benefits
- 2-Layer Rogers 4350 evaluation board with heat sink
- End launch 2.9 mm RF connectors
- Through calibration path
Documentation & Resources
RF, Microwave, and Millimeter Wave Product Selection Guide7/13/20189M
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|ADPA7005AEHZ||Material Declaration||Reliability Data||18-Lead LCC (7mm x 7mm x 1.32mm w/EP)|
|ADPA7005AEHZ-R7||Material Declaration||Reliability Data||18-Lead LCC (7mm x 7mm x 1.32mm w/EP)|
|ADPA7005C-KIT||Material Declaration||Reliability Data||CHIPS OR DIE|
|ADPA7005CHIP||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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