Features and Benefits
- Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz)
- PSAT: 30 dBm (typical at 20 GHz to 34 GHz)
- Gain: 15 dB (typical at 34 GHz to 44 GHz)
- IP3: 40 dBm (typical)
- Supply voltage: 5 V at 600 mA
- Die size: 2.75 mm × 1.805 mm × 0.1 mm
The ADPA7002CHIP is a gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), pseudomorphic high electron mobility transistor (pHEMT), distributed power amplifier that operates from 20 GHz to 44 GHz. The amplifier provides 15 dB of small signal gain, 28 dBm output power at 1 dB gain compression (P1dB), and a typical output third-order intercept (IP3) of 40 dBm. The amplifier requires 600 mA from a 5 V supply on VDD2A, VDD2B, and VDD1. The ADPA7002CHIP also features inputs/outputs (I/Os) that are internally matched to 50 Ω, and facilitates integration into multichip modules (MCMs). All data is taken with the on substrate chip connected via two wire bonds that are 0.025 mm (1 mil) wide and 0.31 mm (12 mils) long.
- Military and space
- Test instrumentation
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The ADPA7002-EVALZ evaluation board consists of a two-layer printed circuit board (PCB) fabricated from 10 mil thick, Rogers 4350 copper clad mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device, as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm, female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device. To calibrate out board trace losses, a through calibration path is provided between J3 and J4. J3 and J4 must be populated with RF connectors to use the through calibration path. Power, ground, gate control voltages, and the detector output voltages are accessed through two 8-pin headers (see Table 1 for header pinout).
The RF traces are 50 Ω, grounded coplanar waveguide. The package ground leads and the exposed paddle directly connect to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle, in order to provide adequate electrical conduction and thermal conduction to the heat sink.
The power supply decoupling capacitors on the evaluation board represent the configuration used to characterize and qualify the device. There can be scope to reduce the number of capacitors, but this varies from system to system. It is recommended to remove or combine the largest capacitors that are farthest from the device first.
For full details on the ADPA7002, see the ADPA7002 data sheet, which should be consulted in conjunction with this user guide when using these evaluation boards.
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
Support & Discussions
Sample & Buy
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