ADPA7002
Info : RECOMMENDED FOR NEW DESIGNS
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ADPA7002

GaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 4
1ku List Price Starting From $126.73
Features
  • Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz)
  • PSAT: 30 dBm (typical at 20 GHz to 34 GHz)
  • Gain: 15 dB (typical at 34 GHz to 44 GHz)
  • IP3: 40 dBm (typical)
  • Supply voltage: 5 V at 600 mA
  • Die size: 2.75 mm × 1.805 mm × 0.1 mm
Additional Details
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The ADPA7002CHIP is a gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), pseudomorphic high electron mobility transistor (pHEMT), distributed power amplifier that operates from 20 GHz to 44 GHz. The amplifier provides 15 dB of small signal gain, 28 dBm output power at 1 dB gain compression (P1dB), and a typical output third-order intercept (IP3) of 40 dBm. The amplifier requires 600 mA from a 5 V supply on VDD2A, VDD2B, and VDD1. The ADPA7002CHIP also features inputs/outputs (I/Os) that are internally matched to 50 Ω, and facilitates integration into multichip modules (MCMs). All data is taken with the on substrate chip connected via two wire bonds that are 0.025 mm (1 mil) wide and 0.31 mm (12 mils) long.

Applications

  • Military and space
  • Test instrumentation
Part Models 4
1ku List Price Starting From $126.73

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADPA7002AEHZ
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ADPA7002AEHZ-R7
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ADPA7002C-KIT
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ADPA7002CHIP
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Product Lifecycle

PCN

Jun 9, 2023

- 23_0129

ADPA7002 Die and Data Sheet Revision

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Part Models

Product Lifecycle

PCN

Jun 9, 2023

- 23_0129

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ADPA7002 Die and Data Sheet Revision

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 1

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EVAL-ADPA7002

ADPA7002 Evaluation Board

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EVAL-ADPA7002

ADPA7002 Evaluation Board

ADPA7002 Evaluation Board

Features and Benefits

  • 2-layer Rogers 4350 evaluation board with heat sink
  • End launch, 2.9 mm, RF connectors
  • Through calibration path

Product Detail

The ADPA7002-EVALZ evaluation board consists of a two-layer printed circuit board (PCB) fabricated from 10 mil thick, Rogers 4350 copper clad mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device, as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm, female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device. To calibrate out board trace losses, a through calibration path is provided between J3 and J4. J3 and J4 must be populated with RF connectors to use the through calibration path. Power, ground, gate control voltages, and the detector output voltages are accessed through two 8-pin headers (see Table 1 for header pinout).

The RF traces are 50 Ω, grounded coplanar waveguide. The package ground leads and the exposed paddle directly connect to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle, in order to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the evaluation board represent the configuration used to characterize and qualify the device. There can be scope to reduce the number of capacitors, but this varies from system to system. It is recommended to remove or combine the largest capacitors that are farthest from the device first.

For full details on the ADPA7002, see the ADPA7002 data sheet, which should be consulted in conjunction with this user guide when using these evaluation boards.

Tools & Simulations

Tools & Simulations 3

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