Analog Devices RF and microwave components are available as drop-in X-MWblocks^®
from Quantic^™ X-Microwave.

Get the X-MWblock® drop-in module for this part.

ADPA7001-Die

RECOMMENDED FOR NEW DESIGNS

50 GHz to 95 GHz, GaAs, pHEMT, MMIC, Wideband Power Amplifier

Data Sheet (Rev. B) Product Selection Table

Part Models: 2
1ku List Price: Starting From $242.57

Viewing:

Overview

Gain: 14.5 dB typical at 50 GHz to 70 GHz
S11: 22 dB typical at 50 GHz to 70 GHz
S22: 19 dB typical at 50 GHz to 70 GHz
P1dB: 17 dBm typical at 50 GHz to 70 GHz
P_SAT: 21 dBm typical

OIP3: 25 dBm typical at 70 GHz to 90 GHz
Supply voltage: 3.5 V at 350 mA
50 Ω matched input/output
Die size: 2.5 mm × 3.32 mm × 0.05 mm

The ADPA7001CHIPS is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), balanced medium power amplifier, with an integrated temperature compensated on-chip power detector that operates from 50 GHz to 95 GHz. In the lower band of 50 GHz to 70 GHz, the ADPA7001CHIPS provides 14.5 dB (typical) of gain, 25.5 dBm output third-order intercept (OIP3), and 17 dBm of output power for 1 dB gain compression. In the upper band of 70 GHz to 90 GHz, the ADPA7001CHIPS provides 14 dB (typical) of gain, 25 dBm output IP3, and 17.5 dBm of output power for 1 dB gain compression. The ADPA7001CHIPS requires 350 mA from a 3.5 V supply. The ADPA7001CHIPS amplifier inputs/outputs are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the chip connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length.

Applications

Test instrumentation
Military and space
Telecommunications infrastructure

Part Models: 2
1ku List Price: Starting From $242.57

Documentation

Data Sheet 1

ADPA7001-Die: 50 GHz to 95 GHz, GaAs, pHEMT, MMIC, Wideband Power Amplifier Data Sheet (Rev.B) 11/02/2018

Application Note 3

AN-2591: When It Comes to Long-Term Reliability of RF Amplifier ICs, Focus First on Die Junction Temperature 08/05/2024

AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers 05/13/2020

AN-1604: Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages 08/01/2019

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADPA7001CHIPS	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADPA7001CHIPS-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

Can't find the software or driver you need?

Request a Driver/Software

Tools & Simulations

S-Parameter 1

ADPA7001CHIPS S-Parameters

ADIsimRF

ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.

Open Tool

Sys-Parameter Models for Keysight Genesys

Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.