ADM3222

PRODUCTION

High-Speed, +3.3V, 2-Channel RS232/V.28 Interface Device with 460kBPS Data Rate and Shutdown and Enable Pins

Data Sheet (Rev. E) Product Selection Table

Part Models: 10
1ku List Price: Starting From $1.78

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Overview

460 kbps Data Rate
Specified at 3.3 V
Meets EIA-232E Specifications
0.1 µF Charge Pump Capacitors
Low Power Shutdown (ADM3222E and ADM1385)
Upgrade for MAX3222/32 and LTC1385

DIP, SO, SOIC, SSOP and TSSOP Package Options
ESD Protection to IEC1000-4-2 (801.2) on RS-232 Pins (ADM3202 Only)
±8 kV: Contact Discharge
±15 kV: Air-Gap Discharge

The ADM3202 / ADM3222 / ADM1385 are high speed, 2-channel RS232/V.28 interface devices which operate from a single +3.3 V power supply. Low power consumption and a shutdown facility (ADM3222 / ADM1385) makes them ideal for battery powered portable instruments.

The ADM3202 / ADM3222 / ADM1385 conform to the EIA-232E and CCITT V.28 specifications and operate at data rates up to 230 kbps. Four external 0.1 µF charge pump capacitors are used for the voltage doubler/inverter permitting operation from a single +3.3 V supply.

The ADM3222 / ADM1385 contain additional enable and shutdown circuitry. The EN input may be used to three-state the receiver outputs. The SD input is used to power down the charge pump and transmitter outputs reducing the quiescent current to less than 1 µA. The receivers remain enabled during shutdown unless disabled using EN.

The ADM3202 is available in a 16-lead DIP, narrow and wide SO as well as a space saving TSSOP package. The ADM3222 is available in 18 lead DIP , SO and in 20 lead SSOP and TSSOP. The ADM1385 is available in a 20 lead SSOP package and is pin compatible with the LTC1385 CG.

Part Models: 10
1ku List Price: Starting From $1.78

Documentation

Data Sheet 1

ADM3202/ADM3222/ADM1385: Low Power, 3.3 V, RS-232 Line Drivers/Receivers Data Sheet (Rev.E) 11/13/2006

Technical Articles 1

Interface Primer 12/22/2010

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADM3222ANZ	18-Lead PDIP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARSZ	20-Lead SSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARSZ-REEL	20-Lead SSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARSZ-REEL7	20-Lead SSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARUZ	20-Lead TSSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARUZ-REEL	20-Lead TSSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARUZ-REEL7	20-Lead TSSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARWZ	18-Lead SOIC (Wide)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARWZ-REEL	18-Lead SOIC (Wide)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADM3222ARWZ-REEL7	18-Lead SOIC (Wide)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
ADM3222ANZ	PRODUCTION
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
ADM3222ANZ	PRODUCTION
Aug 25, 2010 - 10_0065 Halogen Free Material Change for SSOP Products at Carsem
		PCN10_0065_Form Material_Report Reliability Report
ADM3222ARSZ	PRODUCTION
ADM3222ARSZ-REEL	PRODUCTION
ADM3222ARSZ-REEL7	PRODUCTION
Jan 16, 2012 - 11_0244 Halogen Free Material Change for Select TSSOP Products Assembled at Amkor
		PCN11_0244_Form Material_Report Qualification Report Summary
ADM3222ARUZ	PRODUCTION
ADM3222ARUZ-REEL	PRODUCTION
ADM3222ARUZ-REEL7	PRODUCTION
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
ADM3222ARUZ	PRODUCTION
ADM3222ARUZ-REEL	PRODUCTION
ADM3222ARUZ-REEL7	PRODUCTION
Sep 9, 2022 - 22_0148 Assembly Site Transfer for 18L SOIC_W Products
		PCN22_0148_Form Material_Report Other Other
ADM3222ARWZ	PRODUCTION
ADM3222ARWZ-REEL	PRODUCTION
ADM3222ARWZ-REEL7	PRODUCTION
Feb 7, 2011 - 10_0003 Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor
		PCN10_0003_Form Material_Report Qualification Plan Summary
ADM3222ARWZ	PRODUCTION
ADM3222ARWZ-REEL	PRODUCTION
ADM3222ARWZ-REEL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

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