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Features
- Triaxial digital gyroscope, ±500°/sec
- 2.7°/hr in-run bias stability
- 0.15°/√hr angular random walk, x-axis and y-axis, 1 σ
- ±0.25° axis to axis misalignment error
- Triaxial digital accelerometer, ±14 g dynamic range
- 12.7 μg in-run bias stability (x-axis and y-axis)
- Triaxial delta angle and delta velocity outputs
- Factory calibrated sensitivity, bias, and axial alignment
- Calibration temperature range: −40°C to +85°C
- SPI compatible data communications
- Programmable operation and control
- Automatic and manual bias correction controls
- Data ready indicator for synchronous data acquisition
- External sync modes: direct, scaled, and output
- On demand self test of inertial sensors
- Single-supply operation (VDD): 3.0 V to 3.6 V
- 1500 g mechanical shock survivability
- Operating temperature range: −40°C to +105°C
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The ADIS16501 is a precision, miniature microelectromechanical system (MEMS) inertial measurement unit (IMU) that includes a triaxial gyroscope and a triaxial accelerometer. Each inertial sensor in the ADIS16501 combines with signal conditioning that optimizes dynamic performance. The factory calibration characterizes each sensor for sensitivity, bias, alignment, linear acceleration (gyroscope bias), and point of percussion (accelerometer location).
The ADIS16501 provides a simplified, cost-effective method for integrating accurate, multiaxis inertial sensing into industrial systems, especially when compared with the complexity and investment associated with discrete designs. All necessary motion testing and calibration are part of the production process at the factory, greatly reducing system integration time. Tight orthogonal alignment simplifies inertial frame alignment in navigation systems. The serial peripheral interface (SPI) and register structure provide a simple interface for data collection and configuration control.
The ADIS16501 is available in a 100-ball ball grid array (BGA) module (MODULE) that is approximately 15 mm × 15 mm × 5.72 mm.
APPLICATIONS
- Navigation, stabilization, and instrumentation
- Unmanned and autonomous vehicles
- Smart agriculture and construction machinery
- Factory/industrial automation, robotics
- Virtual/augmented reality
- Internet of Moving Things
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Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
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Documentation
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADIS16501-2BMLZ |
100-Ball Ball Grid Array Module (15mm x 15mm x 5.72mm)
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- ADIS16501-2BMLZ
- Pin/Package Drawing
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100-Ball Ball Grid Array Module (15mm x 15mm x 5.72mm)
- Documentation
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Material Declaration
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Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
Evaluation Kits 1
EVAL-ADIS16501
ADIS16501-2/PCBZ MEMS IMU Breakout Board
Product Detail
The ADIS16501-2/PCBZ breakout board offers a simple method for developing a prototype connection between the ADIS16501 inertial measurement unit (IMU) and any existing embedded processor platform that supports serial peripheral interface (SPI) communications. The ADIS16501-2/PCBZ comes pre-equipped with the ADIS16501 IMU and a 16-pin header that is designed to connect seamlessly with 2 mm ribbon cables. Generally, this board supports reliable communication over ribbon cables up to 20 cm in length. However, for optimal performance, especially when dealing with critical communication links, it is recommended to validate the signal integrity before entirely relying on this type of connection.
Resources
