ADG811
PRODUCTION<0.5 Ω CMOS, 1.65 V to 3.6 V, Quad SPST Switches
- Part Models
- 2
- 1ku List Price
- Starting From $2.31
Overview
- 0.5 Ω typical on resistance
- 0.8 Ω maximum on resistance at 125°C
- Automotive temperature range: −40°C to +125°C
- High current carrying capability: 300 mA continuous
- 1.65 V to 3.6 V operation
- Rail-to-rail switching operation
- Fast switching times: <25 ns
- Typical power consumption <0.1 μW
The ADG811 / ADG812 / ADG813 are low voltage CMOS devices containing four independently selectable switches. These switches offer ultralow on resistance of less than 0.8 Ω over the full temperature range. The digital inputs can handle 1.8 V logic with a 2.7 V to 3.6 V supply.
These devices contain four independent single-pole/single-throw (SPST) switches. The ADG811 and ADG812 differ only in that the digital control logic is inverted. The ADG811 switches are turned on with a logic low on the appropriate control input, while a logic high is required to turn on the switches of the ADG812. The ADG813 contains two switches whose digital control logic is similar to the ADG811, while the logic is inverted on the other two switches.
Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. The ADG813 exhibits break-before-make switching action.
The ADG811 / ADG812 / ADG813 are fully specified for 3.3 V, 2.5 V, and 1.8 V supply operation. The ADG811 is available in a 16-lead TSSOP package and a 16-lead LFCSP package, and the ADG812 / ADG813 are available in a 16-lead TSSOP package.
PRODUCT HIGHLIGHTS
- <0.8 Ω over full temperature range of −40°C to +125°C.
- Single 1.65 V to 3.6 V operation.
- Operational with 1.8 V CMOS logic.
- High current handling capability (300 mA continuous current at 3.3 V).
- Low THD + N (0.02% typical).
- Small 3 mm × 3 mm LFCSP package and 16-lead TSSOP package.
APPLICATIONS
- Cellular phones
- MP3 players
- Power routing
- Battery-powered systems
- PCMCIA cards
- Modems
- Audio and video signal routing
- Communications systems
Documentation
Data Sheet 1
User Guide 1
Technical Articles 2
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG811YCPZ-REEL7 | 16-Lead LFCSP (3mm x 3mm w/ EP) | ||
| ADG811YRUZ | 16-Lead TSSOP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Aug 19, 2020 - 20_0174 ADG811, ADG812, ADG836, ADG836L, ADG804 Ron specification changes |
||
| ADG811YCPZ-REEL7 | PRODUCTION | |
| ADG811YRUZ | PRODUCTION | |
|
Jul 17, 2015 - 15_0146 ADG811 Wafer Fabrication Change from TSMC Fab 7A to TSMC Fab 11 |
||
| ADG811YCPZ-REEL7 | PRODUCTION | |
| ADG811YRUZ | PRODUCTION | |
|
Feb 13, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines. |
||
| ADG811YCPZ-REEL7 | PRODUCTION | |
|
Jul 1, 2025 - 25_0162 Gold to Copper Wire Conversion |
||
| ADG811YRUZ | PRODUCTION | |
|
Jan 20, 2012 - 11_0218 Halogen Free Material Change for Certain TSSOP Products at Carsem |
||
| ADG811YRUZ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
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LTspice
Models for the following parts are available in LTspice:
- ADG811
SPICE Model 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.