ADG725
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ADG725

Differential 16-Channel, Serially Controlled 3.5 Ω 1.8 V to 5.5 V, ±2.5 V, Analog Multiplexer

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 2
1ku List Price Starting From $7.25
Features
  • 3-Wire SPI Compatible Serial Interface
  • 1.8 V to 5.5 V Single Supply
  • ±2.5 V Dual-Supply Operation
  • 4 Ω On Resistance
  • 0.5 Ω On Resistance Flatness
  • 7 mm x 7 mm 48-Lead Chip Scale Package (LFCSP) or 48-Lead TQFP Package
  • Rail-to-Rail Operation
  • Power-On Reset
  • See data sheet for additional features
Additional Details
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The ADG731/ADG725 are monolithic, CMOS, 32-channel/dual 16-channel analog multiplexers with a serially controlled 3-wire interface. The ADG731 switches one of 32 inputs (S1–S32) to a common output, D. The ADG725 can be configured as a dual mux switching one of 16 inputs to one output, or a differential mux switching one of 16 inputs to a differential output.

These mulitplexers utilize a 3-wire serial interface that is compatible with SPI®, QSPI, MICROWIRE, and some DSP interface standards. On power-up, the Internal Shift Register contains all zeros and all switches are in the OFF state.

These multiplexers are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed with very low on resistance and leakage currents. They operate from a single supply of 1.8 V to 5.5 V or a ±2.5 V dual supply, making them ideally suited to a variety of applications. On resistance is in the region of a few ohms, is closely matched between switches, and is very flat over the full signal range.

These parts can operate equally well as either multiplexers or demultiplexers and have an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit break-before-make switching action, preventing momentary shorting when switching channels.

The ADG731 and ADG725 are serially controlled 32-channel, and dual/differential 16-channel multiplexers, respectively. They are available in either a 48-lead LFCSP or TQFP package.

Product Highlights

  1. 3-Wire Serial Interface.
  2. 1.8 V to 5.5 V Single-Supply or ±2.5 V Dual-Supply Operation. These parts are specified and guaranteed with 5 V ± 10%, 3 V ± 10% single-supply, and ± 2.5 V ±10% dual-supply rails.
  3. On Resistance of 4 W.
  4. Guaranteed Break-Before-Make Switching Action.
  5. 7 mm ×7 mm 48-Lead Chip Scale Package (LFCSP) or 48-Lead TQFP Package.

APPLICATIONS

  • Optical Applications
  • Data Acquisition Systems
  • Communication Systems
  • Relay Replacement
  • Audio and Video Switching
  • Battery-Powered Systems
  • Medical Instrumentation
  • Automatic Test Equipment
Part Models 2
1ku List Price Starting From $7.25

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG725BCPZ
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ADG725BSUZ
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Product Lifecycle

PCN

Nov 10, 2022

- 22_0277

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Apr 29, 2015

- 14_0049

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Jan 5, 2009

- 07_0077

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Nov 10, 2022

- 22_0277

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Apr 29, 2015

- 14_0049

arrow down

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Jan 5, 2009

- 07_0077

arrow down

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

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Software & Part Ecosystem

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