ADG659
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ADG659

+3 V/+5 V/±5 V CMOS 4-Channel Analog Multiplexer

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Part Details
Part Models 6
1ku List Price Starting From $2.00
Features
  • ±2 V to ±6 V dual supply
  • 2 V to 12 V single supply
  • Automotive temperature range −40°C to +125°C
  • <0.1 nA leakage currents
  • 45 Ω on resistance over full signal range
  • Rail-to-rail switching operation
  • Differential 4-to-1 multiplexer
  • 16-lead LFCSP/TSSOP/QSOP packages
  • Typical power consumption <0.1 μW
  • TTL/CMOS compatible inputs
  • Package upgrades to 74HC4051 / 74HC4052 and MAX4051 / MAX4052 / MAX4581 / MAX4582
Additional Details
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The ADG658 and ADG659 are low voltage, CMOS analog multiplexers comprised of eight single channels and four differential channels, respectively. The ADG658 switches one of eight inputs (S1–S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG659 switches one of four differential inputs to a common differential output, as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices enables or disables the device. When disabled, all channels are switched off.

These devices are designed on an enhanced process that provides lower power dissipation yet gives high switching speeds. These devices can operate equally well as either multiplexers or demultiplexers and have an input range that extends to the supplies. All channels exhibit break-before-make switching action, preventing momentary shorting when switching channels. All digital inputs have 0.8 V to 2.4 V logic thresholds, ensuring TTL/CMOS logic compatibility when using single +5 V or dual ±5 V supplies.

The ADG658 and ADG659 are available in 16-lead TSSOP/QSOP packages and 16-lead 4 mm × 4 mm LFCSP packages.

Product Highlights

  1. Single- and dual-supply operation. The ADG658 and ADG659 offer high performance and are fully specified and guaranteed with ±5 V, +5 V, and +3 V supply rails.
  2. Automotive temperature range −40°C to +125°C.
  3. Low power consumption, typically <0.1 μW.
  4. 16-lead 4 mm × 4 mm LFCSP packages, 16-lead TSSOP package and 16-lead QSOP package.

Applications

  • Automotive applications
  • Automatic test equipment
  • Data acquisition systems
  • Battery-powered systems
  • Communication systems
  • Audio and video signal routing
  • Relay replacement
  • Sample-and-hold systems
  • Industrial control systems
Part Models 6
1ku List Price Starting From $2.00

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
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ADG659YCPZ
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ADG659YCPZ-REEL7
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ADG659YRQZ
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Product Lifecycle

PCN

Jan 16, 2012

- 11_0244

Halogen Free Material Change for Select TSSOP Products Assembled at Amkor

ADG659WYRUZ-REEL7

PRODUCTION

ADG659YRUZ

PRODUCTION

ADG659YRUZ-REEL7

PRODUCTION

May 5, 2014

- 14_0020

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 3, 2009

- 08_0001

Qualification of 8" 3um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland.

ADG659YCPZ

PRODUCTION

ADG659YCPZ-REEL7

PRODUCTION

ADG659YRQZ

PRODUCTION

ADG659YRUZ

PRODUCTION

ADG659YRUZ-REEL7

PRODUCTION

Feb 15, 2010

- 07_0061

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Aug 26, 2010

- 10_0001

Halogen Free Material Change for QSOP Products

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jan 16, 2012

- 11_0244

arrow down

Halogen Free Material Change for Select TSSOP Products Assembled at Amkor

ADG659WYRUZ-REEL7

PRODUCTION

ADG659YRUZ

PRODUCTION

ADG659YRUZ-REEL7

PRODUCTION

May 5, 2014

- 14_0020

arrow down

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 3, 2009

- 08_0001

arrow down

Qualification of 8" 3um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland.

ADG659YCPZ

PRODUCTION

ADG659YCPZ-REEL7

PRODUCTION

ADG659YRQZ

PRODUCTION

ADG659YRUZ

PRODUCTION

ADG659YRUZ-REEL7

PRODUCTION

Feb 15, 2010

- 07_0061

arrow down

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Aug 26, 2010

- 10_0001

arrow down

Halogen Free Material Change for QSOP Products

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

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EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

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EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Features and Benefits

  • 16 lead TSSOP evaluation board
  • Clamp to allow the main device to be changed easily
  • Gold pin connectors to allow the addition of passive components
  • SMB connectors for the input/output of signals
  • Additional space on board to allow for prototyping

Product Detail

The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

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