ADG658-DSCC: Military Data Sheet1/5/2018
ADG658-EP: Enhanced Product Data Sheet (Rev. 0)8/28/2017213 K
ADG658/ADG659: +3 V/+5 V/±5 V CMOS 4- and 8-Channel Analog Multiplexers Data Sheet (Rev. D)3/1/2003388 K
Features and Benefits
- ±2 V to ±6 V dual supply
- 2 V to 12 V single supply
- Automotive temperature range −40°C to +125°C
- <0.1 nA leakage currents
- 45 Ω on resistance over full signal range
- Rail-to-rail switching operation
- Single 8-to-1 multiplexer
- 16-lead LFCSP/TSSOP/QSOP packages
- Typical power consumption <0.1 μW
- TTL/CMOS compatible inputs
- Download ADG658-EP data sheet (pdf)
- Military temperature range: −55°C to +125°C
- Controlled manufacturing baseline
- One assembly/test site
- One fabrication site
- Enhanced product change notification
- V62/17613 DSCC Drawing Number
The ADG658 and ADG659 are low voltage, CMOS analog multiplexers comprised of eight single channels and four differential channels, respectively. The ADG658 switches one of eight inputs (S1–S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG659 switches one of four differential inputs to a common differential output, as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices enables or disables the device. When disabled, all channels are switched off.
These devices are designed on an enhanced process that provides lower power dissipation yet gives high switching speeds. These devices can operate equally well as either multiplexers or demultiplexers and have an input range that extends to the supplies. All channels exhibit break-before-make switching action, preventing momentary shorting when switching channels. All digital inputs have 0.8 V to 2.4 V logic thresholds, ensuring TTL/CMOS logic compatibility when using single +5 V or dual ±5 V supplies.
The ADG658 and ADG659 are available in 16-lead TSSOP/QSOP packages and 16-lead 4 mm × 4 mm LFCSP packages.
- Single- and dual-supply operation. The ADG658 and ADG659 offer high performance and are fully specified and guaranteed with ±5 V, +5 V, and +3 V supply rails.
- Automotive temperature range −40°C to +125°C.
- Low power consumption, typically <0.1 μW.
- 16-lead 4 mm × 4 mm LFCSP packages, 16-lead TSSOP package and 16-lead QSOP package.
- Automotive applications
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Communication systems
- Audio and video signal routing
- Relay replacement
- Sample-and-hold systems
- Industrial control systems
Markets and Technologies
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Evaluation Kits (2)
The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.
Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.
Features & Benefits
- 16-lead, 4 mm × 4 mm LFCSP evaluation board
- Easily changeable clamshell socket for the main device
- Gold pin connectors for the addition of passive components
- SMB connectors for the input and output of signals
- Additional space on board for prototyping
The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Features & Benefits
- 16 lead TSSOP evaluation board
- Clamp to allow the main device to be changed easily
- Gold pin connectors to allow the addition of passive components
- SMB connectors for the input/output of signals
- Additional space on board to allow for prototyping
Documentation & Resources
Switches and Multiplexers Product Selection Guide5/9/2008614 K
Low-Noise, Gain-Selectable Amplifier3/1/2012 Analog Dialogue
Data-acquisition system uses fault protection4/15/2004
Temperature monitor measures three thermal zones12/11/2003
Enhanced Multiplexing for MEMS Optical Cross Connects8/1/2003
Tools & Simulations
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|ADG658TRUZ-EP||Material Declaration||Reliability Data||16-Lead TSSOP|
|ADG658TRUZ-EP-RL7||Material Declaration||Reliability Data||16-Lead TSSOP|
|ADG658YCPZ||Material Declaration||Reliability Data||16-Lead LFCSP (4mm x 4mm w/ EP)|
|ADG658YCPZ-REEL7||Material Declaration||Reliability Data||16-Lead LFCSP (4mm x 4mm w/ EP)|
|ADG658YRQZ||Material Declaration||Reliability Data||16-Lead QSOP|
|ADG658YRQZ-REEL7||Material Declaration||Reliability Data||16-Lead QSOP|
|ADG658YRUZ||Material Declaration||Reliability Data||16-Lead TSSOP|
|ADG658YRUZ-REEL7||Material Declaration||Reliability Data||16-Lead TSSOP|
|ADW54003-0||Material Declaration||Reliability Data||16-Lead TSSOP|
|ADW54003-0RL7||Material Declaration||Reliability Data||16-Lead TSSOP|
|Wafer Fabrication Data|
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.