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Features
- +3V, +5V and ± 5 V Power Supplies
- Ultralow Power Dissipation (<0.5 µW )
- Low Leakage (< 100 pA)
- Low On-Resistance (<50 Ω)
- Fast Switching Times
- Low Charge Injection
- TTL/CMOS-Compatible Inputs
- 16-Lead DIP and SOIC Packages
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The ADG511, ADG512 and ADG513 are monolithic CMOS ICs containing four independently selectable analog switches. These switches feature low, well-controlled on resistance and wide analog signal range, making them ideal for precision analog signal switching.
These switch arrays are fabricated using Analog Devices’ advanced linear compatible CMOS (LC2MOS) process which offers the additional benefits of low leakage currents, ultralow power dissipation and low capacitance for fast switching speeds with minimum charge injection. These features make the ADG511, ADG512 and ADG513 the optimum choice for a wide variety of signal switching tasks in precision analog signal processing and data acquisition systems.
The ability to operate from single +3 V, +5 V or ±5 V bipolar supplies make the ADG511, ADG512 and ADG513 perfect for use in battery-operated instruments, 4–20 mA loop systems and with the new generation of DACs and ADCs from Analog Devices. The use of 5 V supplies and reduced operating currents give much lower power dissipation than devices operating from ±15 V supplies.
The ADG511, ADG512 and ADG513 contain four independent SPST switches. The ADG511 and ADG512 differ only in that the digital control logic is inverted. The ADG511 switch is turned on with a logic low on the appropriate control input, while a logic high is required for the ADG512. The ADG513 contains two switches whose digital control logic is similar to that of the ADG511 while the logic is inverted in the remaining two switches.
PRODUCT HIGHLIGHTS
- 5 Volt Single Supply Operation
The ADG511 / ADG512 / ADG513 offers high performance, including low on resistance and wide signal range, fully specified and guaranteed with +3 V, ±5 V as well as +5 V supply rails. - Ultralow Power Dissipation
CMOS construction ensures ultralow power dissipation. - Low RON
- Break-Before-Make Switching
Switches are guaranteed to have break-before-make operation. This allows multiple outputs to be tied together for multiplexer applications without the possibility of momentary shorting between channels.
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ADG513
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG513BNZ |
16-Lead PDIP
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| ADG513BRZ |
16-Lead SOIC
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| ADG513BRZ-REEL |
16-Lead SOIC
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| ADG513BRZ-REEL7 |
16-Lead SOIC
|
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- ADG513BNZ
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16-Lead PDIP
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HTML
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Ultra Librarian
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SamacSys
- ADG513BRZ
- Pin/Package Drawing
-
16-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG513BRZ-REEL
- Pin/Package Drawing
-
16-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG513BRZ-REEL7
- Pin/Package Drawing
-
16-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
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PCN
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
ADG513BNZ
PRODUCTION
Mar 25, 2021
- 21_0080
Amkor Philippines as an Alternate Site for SOICN
ADG513BRZ
PRODUCTION
ADG513BRZ-REEL
PRODUCTION
ADG513BRZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
ADG513BRZ
PRODUCTION
ADG513BRZ-REEL
PRODUCTION
ADG513BRZ-REEL7
PRODUCTION
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
ADG513BRZ
PRODUCTION
ADG513BRZ-REEL
PRODUCTION
ADG513BRZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
ADG513BNZ
PRODUCTION
Mar 25, 2021
- 21_0080
Amkor Philippines as an Alternate Site for SOICN
ADG513BRZ
PRODUCTION
ADG513BRZ-REEL
PRODUCTION
ADG513BRZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
ADG513BRZ
PRODUCTION
ADG513BRZ-REEL
PRODUCTION
ADG513BRZ-REEL7
PRODUCTION
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
ADG513BRZ
PRODUCTION
ADG513BRZ-REEL
PRODUCTION
ADG513BRZ-REEL7
PRODUCTION
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