ADG417
Info: : PRODUCTION
searchIcon
cartIcon

ADG417

LC2MOS, ±15 V Precision Mini-DIP SPST Switch

Show More showmore-icon

Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 3
1ku List Price Starting From $1.67
Features
  • 44 V Supply Maximum Ratings
  • VSS to VDD Analog Signal Range
  • Low On Resistance (<35Ω)
  • Ultralow Power Dissipation (<35 µW)
  • Break-Before-Make Switching Action
  • Fast Switching Times 
    ton (160 ns max)
    toff (100 ns max)
  • Plug-In Replacement for DG417
  • 8-Lead DIP and SOIC Packages
Additional Details
show more Icon

The ADG417 is a monolithic CMOS SPST switch. This switch is designed on an enhanced LC2MOS process that provides low power dissipation yet gives high switching speed, low on resistance and low leakage currents.

The on resistance profile of the ADG417 is very flat over the full analog input range ensuring excellent linearity and low distortion. The part also exhibits high switching speed and high signal bandwidth. CMOS construction ensures ultralow power dissipation making the parts ideally suited for portable and battery powered instruments.

The ADG417 switch, which is turned ON with a logic low on the control input, conducts equally well in both directions when ON and has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. The ADG417 exhibits break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection for minimum transients when switching the digital input.

Applications

  • Precision Test Equipment
  • Precision Instrumentation
  • Battery Powered Systems
  • Sample Hold Systems
Part Models 3
1ku List Price Starting From $1.67

close icon
Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG417BNZ
  • HTML
  • HTML
ADG417BRZ
  • HTML
  • HTML
ADG417BRZ-REEL
  • HTML
  • HTML

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 23, 2010

- 10_0004

Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 23, 2010

- 10_0004

arrow down

Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Software & Part Ecosystem

Software & Part Ecosystem

Recently Viewed