ADG212A
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ADG212A

Quad SPST Switch

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warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 4
1ku List Price Starting From $2.03
Features
  • 44 V Supply Maximum Ratings
  • ± 15 V Analog Signal Range
  • Low On-Resistance (115 O max)
  • Low Leakage: 0.5 nA typical
  • Break-Before-Make Switching Action
  • Extended Plastic Temperature Range: (-40°C to +85°C)
  • See datasheet for additional features


Additional Details
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The ADG211A and ADG212A are monolithic CMOS devices comprising four independently selectable switches. They are designed on an enhanced LC2 MOS process, which gives an increased signal handling capability of ±15 V. These switches also feature high switching speeds and low RON.

The ADG211A and ADG212A consist of four SPST switches. They differ only in that the digital control logic is inverted. In multiplexer applications, all switches exhibit break-before-make switching action when driven simultaneously. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.

PRODUCT HIGHLIGHTS

  1. Extended Signal Range.
    These switches are fabricated on an enhanced LC2 MOS process, resulting in high breakdown and an increased analog signal range of ±15 V.
  2. Single Supply Operation.
    For applications where the analog signal is unipolar (0 V to 15 V), the switches can be operated from a single 15 V supply.
  3. Low Leakage.
    Leakage currents in the range of 500 pA make these switches suitable for high precision circuits. The added feature of break-before-make allows for multiple outputs to be tied together for multiplexer applications while keeping leakage errors to a minimum.
Part Models 4
1ku List Price Starting From $2.03

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG212AKNZ
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ADG212AKPZ
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ADG212AKRZ
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ADG212AKRZ-REEL
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Product Lifecycle

PCN

Mar 29, 2021

- 21_0033

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 6, 2014

- 13_0234

Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages

Oct 5, 2010

- 10_0146

Halogen Free Material Change for 14/16L SOIC_N Products

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Mar 29, 2021

- 21_0033

arrow down
Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 6, 2014

- 13_0234

arrow down

Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages

Oct 5, 2010

- 10_0146

arrow down

Halogen Free Material Change for 14/16L SOIC_N Products

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