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The ADG201A switches are turned on with a logic low on the appropriate control input. Each switch conducts equally well in both directions when ON and each has an input signal range that extends to the supplies. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
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ADG201S
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Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG2010803Q |
16-Lead CerDIP
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- ADG2010803Q
- Pin/Package Drawing
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16-Lead CerDIP
- Documentation
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Material Declaration
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SamacSys
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Part Models
Product Lifecycle
PCN
Jul 30, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Feb 26, 2016
- 16_0044
ADG201 Change in Wafer Diameter for Aerospace Models
ADG2010803Q
Nov 18, 2015
- 15_0219
Laser Marking Standardization for Aerospace Packages
Oct 2, 2013
- 13_0163
Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
ADG2010803Q
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
ADG2010803Q
Feb 9, 2009
- 08_0073
Change of Seal Glass Material for Cerdip & Cerpak Packages
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 30, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Feb 26, 2016
- 16_0044
ADG201 Change in Wafer Diameter for Aerospace Models
Nov 18, 2015
- 15_0219
Laser Marking Standardization for Aerospace Packages
Oct 2, 2013
- 13_0163
Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 9, 2009
- 08_0073
Change of Seal Glass Material for Cerdip & Cerpak Packages
