Features and Benefits
- 50 ns max Switching Time Over Full Temperature Range
- Single Supply Specs for +10.9 V to 16.5 V Operation
- Extended Plastic Temperature Range (-40°C to +85°C)
- Break-Before-Make Switching Action
- Low RON (30Ω max)
- Low Leakage (100 pA typ)
- 44 V Supply Maximum Ratings
- Available in 16-Lead DIP/SOIC and 20-Lead LCCC/PLCC Packages
ADG201HS (K, B, T) Replaces HI-201HS
ADG201HS (J, A, S) Replaces DG271
The ADG201HS is a monolithic CMOS device comprising four independently selectable SPST switches. It is designed on an enhanced LC2 MOS process which gives very fast switching speeds and low RON.
The switches also feature break-before-make switching action for use in multiplexer applications and low charge injection for minimum transients on the output when switching the digital inputs.
- 50ns max tON and tOFF:
The ADG201HS top grades (K, B, T) have guaranteed 50ns max turn-on and turn-off times over the full operating temperature range. The lower grades (J,A,S) have guaranteed 75ns switching times over the full operating temperature range.
- Single Supply Specifications:
The ADG201HS is fully specified for applications which require a single positive power supply in the + 10.8V to +16.5V range.
- Low Leakage:
Leakage currents in the range of 100pA make these switches suitable for high precision circuits. The added feature of break-before-make allows for multiple outputs to be tied together for multiplexer applications while keeping leakage errors to a minimum.
Product Lifecycle Not Recommended for New Designs
This designates products ADI does not recommend broadly for new designs.
Documentation & Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|ADG201HSBCHIPS||Material Declaration||Reliability Data||none available|
|ADG201HSJNZ||Material Declaration||Reliability Data||16-Lead PDIP|
|ADG201HSJPZ||Material Declaration||Reliability Data||20-Lead Flatpack|
|ADG201HSKNZ||Material Declaration||Reliability Data||16-Lead PDIP|
|ADG201HSKPZ||Material Declaration||Reliability Data||20-Lead Flatpack|
|ADG201HSKRZ||Material Declaration||Reliability Data||16-Lead SOIC|
|ADG201HSKRZ-REEL||Material Declaration||Reliability Data||16-Lead SOIC|
|ADG201HSTCHIPS||Material Declaration||Reliability Data||none available|
|Wafer Fabrication Data|
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