ADG1613
1 Ω Typical On Resistance, ±5 V, +12 V, +5 V, and +3.3 V Quad SPST Switches
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Features
- 1 Ω typical on resistance
- 0.2 Ω on resistance flatness
- ±3.3 V to ±8 V dual-supply operation
- 3.3 V to 16 V single-supply operation
- No VL supply required
- 3 V logic-compatible inputs
- Rail-to-rail operation
- See data sheet for additional features
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The ADG1611 / ADG1612 / ADG1613 contain four independent single-pole/single-throw (SPST) switches. The ADG1611 and ADG1612 differ only in that the digital control logic is inverted. The ADG1611 switches are turned on with Logic 0 on the appropriate control input, while Logic 1 is required for the ADG1612 switches. The ADG1613 has two switches with digital control logic similar to that of the ADG1611; the logic is inverted on the other two switches. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.
The ADG1613 exhibits break-before-make switching action for use in multiplexer applications. Inherent in the design is the low charge injection for minimum transients when switching the digital inputs.
The ultralow on resistance of these switches make them ideal solutions for data acquisition and gain switching applications where low on resistance and distortion is critical. The on resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching audio signals.
The CMOS construction ensures ultralow power dissipation, making them ideally suited for portable and battery-powered instruments.
PRODUCT HIGHLIGHTS
- 1.6 Ω maximum on resistance over temperature
- Minimum distortion: THD + N = 0.007%
- 3 V logic-compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V
- No VL logic power supply required.
- Ultralow power dissipation: <16 nW
- 16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP
APPLICATIONS
- Communication systems
- Medical systems
- Audio signal routing
- Video signal routing
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Sample-and-hold systems
- Relay replacements
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ADG1613
Documentation
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Data Sheet 1
User Guide 1
Informational 1
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1613BCPZ-REEL |
16-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG1613BCPZ-REEL7 |
16-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG1613BRUZ |
16-Lead TSSOP
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| ADG1613BRUZ-REEL |
16-Lead TSSOP
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| ADG1613BRUZ-REEL7 |
16-Lead TSSOP
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- ADG1613BCPZ-REEL
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1613BCPZ-REEL7
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1613BRUZ
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1613BRUZ-REEL
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1613BRUZ-REEL7
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1613BCPZ-REEL
PRODUCTION
ADG1613BCPZ-REEL7
PRODUCTION
Sep 14, 2009
- 09_0190
ADG1611/12/13, ADG1604 and ADG1636 Datasheet specification change
ADG1613BCPZ-REEL
PRODUCTION
ADG1613BCPZ-REEL7
PRODUCTION
ADG1613BRUZ
PRODUCTION
ADG1613BRUZ-REEL
PRODUCTION
ADG1613BRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1613BRUZ
PRODUCTION
ADG1613BRUZ-REEL
PRODUCTION
ADG1613BRUZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1613BCPZ-REEL
PRODUCTION
ADG1613BCPZ-REEL7
PRODUCTION
Sep 14, 2009
- 09_0190
ADG1611/12/13, ADG1604 and ADG1636 Datasheet specification change
ADG1613BCPZ-REEL
PRODUCTION
ADG1613BCPZ-REEL7
PRODUCTION
ADG1613BRUZ
PRODUCTION
ADG1613BRUZ-REEL
PRODUCTION
ADG1613BRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1613BRUZ
PRODUCTION
ADG1613BRUZ-REEL
PRODUCTION
ADG1613BRUZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 2
EVAL-16LFCSP
Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.
Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.
EVAL-16TSSOP
Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio
Product Detail
The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 1
SPICE Model 1
SPICE Model
