ADG1438
±15 V/+12 V/±5 V, Single 8 to 1 Multiplexer, Serially Controlled Matrix Switch
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Features
- Serial interface up to 50 MHz
- SDO daisy-chaining option
- 9.5 Ω on resistance at 25°C
- 1.6 Ω on-resistance flatness
- Fully specified at ±15 V/+12 V/±5 V
- 3 V logic-compatible inputs
- Rail-to-rail operation
- 20-lead TSSOP and 20-lead, 4 mm × 4 mm LFCSP
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The ADG1438 and ADG1439 are CMOS analog matrix switches with a serially controlled 3-wire interface. The ADG1438 is an 8-channel matrix switch, and the ADG1439 is a dual 4-channel matrix switch.
The ADG1438/ADG1439 use a versatile 3-wire serial interface that operates at clock rates of up to 50 MHz and is compatible with standard SPI, QSPI™, MICROWIRE™, and DSP interface standards. The output of the shift register, SDO, enables a number of the ADG1438/ADG1439 devices to be daisy-chained. On power-up, the internal shift register contains all zeros, and all switches are in the off state.
Each switch conducts equally well in both directions when on, making these devices suitable for both multiplexing and demultiplexing applications. Because each switch is turned on or off by a separate bit, these devices can also be configured as a type of switch array, where any, all, or none of the eight switches can be closed at any time. The input signal range extends to the supply rails. All channels exhibit break-before-make switching action, preventing momentary shorting when switching channels.
The ultralow on resistance and on-resistance flatness of these switches make them ideal solutions for data acquisition and gain switching applications where low distortion is critical. iCMOS® construction ensures ultralow power dissipation, making the parts ideally suited for portable and battery-powered instruments.
Product Highlights
- 50 MHz serial interface.
- 9.5 Ω on resistance.
- 1.6 Ω on-resistance flatness.
- 3 V logic-compatible digital input, VINH = 2.0 V, VINL = 0.8 V.
Applications
- Relay replacement
- Audio and video routing
- Automatic test equipment
- Data acquisition systems
- Temperature measurement systems
- Avionics
- Battery-powered systems
- Communication systems
- Medical equipment
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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ADG1438
Documentation
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1438BCPZ-REEL7 |
20-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG1438BRUZ |
20-Lead TSSOP
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| ADG1438BRUZ-REEL7 |
20-Lead TSSOP
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- ADG1438BCPZ-REEL7
- Pin/Package Drawing
-
20-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1438BRUZ
- Pin/Package Drawing
-
20-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1438BRUZ-REEL7
- Pin/Package Drawing
-
20-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 25, 2017
- 17_0068
CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices
ADG1438BCPZ-REEL7
PRODUCTION
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1438BCPZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 25, 2017
- 17_0068
CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices
ADG1438BCPZ-REEL7
PRODUCTION
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1438BCPZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-24TSSOP
Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-24TSSOPEBZ evaluation board evaluates 24-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-24TSSOPEBZ to secure a 24-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 24-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K24 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 1
IBIS Model 1
IBIS Model
