ADG1407
9.5 Ω RON, 16-Channel, Differential 8-Channel, ±15 V/+12 V/±5 V iCMOS Multiplexers
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Features
- 9.5 Ω on resistance at 25°C
- Up to 300 mA of continuous current
- Fully specified at ±15 V/+12 V/±5 V
- 3 V logic-compatible inputs
- Rail-to-rail operation
- Break-before-make switching action
- 28-lead TSSOP and 32-lead, 5 mm × 5 mm LFCSP
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The ADG1406 and ADG1407 are monolithic iCMOS® analog multiplexers comprising 16 single channels and eight differential channels, respectively. The ADG1406 switches one of 16 inputs to a common output, as determined by the 4-bit binary address lines (A0, A1, A2, and A3). The ADG1407 switches one of eight differential inputs to a common differential output, as determined by the 3-bit binary address lines (A0, A1, and A2). An EN input on both devices enables or disables the device. When disabled, all channels switch off. When on, each channel conducts equally well in both directions and has an input signal range that extends to the supplies.
The iCMOS (industrial CMOS) modular manufacturing process combines high voltage CMOS (complementary metaloxide semiconductor) and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no other generation of high voltage parts has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.
The ultralow on resistance and on-resistance flatness of these switches make them ideal solutions for data acquisition and gain switching applications where low distortion is critical. iCMOS construction ensures ultralow power dissipation, making the parts ideally suited for portable and battery-powered instruments.
Applications
- Medical equipment
- Audio and video routing
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Sample-and-hold systems
- Communication systems
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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ADG1407
Documentation
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Data Sheet 1
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Informational 1
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1407BCPZ-REEL7 |
32-Lead LFCSP (5mm x 5mm w/ EP)
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|
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| ADG1407BRUZ |
28-Lead TSSOP (4.4mm x 9.7mm)
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| ADG1407BRUZ-REEL7 |
28-Lead TSSOP (4.4mm x 9.7mm)
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|
- ADG1407BCPZ-REEL7
- Pin/Package Drawing
-
32-Lead LFCSP (5mm x 5mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1407BRUZ
- Pin/Package Drawing
-
28-Lead TSSOP (4.4mm x 9.7mm)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1407BRUZ-REEL7
- Pin/Package Drawing
-
28-Lead TSSOP (4.4mm x 9.7mm)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 5, 2022
- 21_0271
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG1407BCPZ-REEL7
PRODUCTION
Nov 10, 2014
- 14_0047
Conversion of 5x5mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1407BCPZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1407BCPZ-REEL7
PRODUCTION
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1407BCPZ-REEL7
PRODUCTION
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 5, 2022
- 21_0271
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG1407BCPZ-REEL7
PRODUCTION
Nov 10, 2014
- 14_0047
Conversion of 5x5mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1407BCPZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1407BCPZ-REEL7
PRODUCTION
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1407BCPZ-REEL7
PRODUCTION
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1407BRUZ
PRODUCTION
ADG1407BRUZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-28TSSOPEBZ
EVAL-28TSSOPEBZ Evaluation Board
Product Detail
A 28-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K28 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
