ADCMP567
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ADCMP567

Dual Ultrafast Voltage Comparator

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Info: : PRODUCTION tooltip
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Part Details
Part Models 1
1ku List Price Starting From $4.71
Features
  • 250 ps propagation delay input to output
  • 50 ps propagation delay dispersion
  • Differential PECL compatible outputs
  • Differential latch control
  • Robust input protection
  • Input common-mode range −2.0 V to ±3.0 V
  • Input differential range ±5 V
  • See datasheet for additional features

Additional Details
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The ADCMP567 is an ultrafast voltage comparator fabricated on Analog Devices, Inc., proprietary XFCB process. The device features 250 ps propagation delay with less than 35 ps overdrive dispersion. Overdrive dispersion, a particularly important characteristic of high speed comparators, is a measure of the difference in propagation delay under differing overdrive conditions.

A fast, high precision differential input stage permits consistent propagation delay with a wide variety of signals in the common-mode range from −2.0 V to +3.0 V. Outputs are complementary digital signals fully compatible with PECL 10 K and 10 KH logic families. The outputs provide sufficient drive current to directly drive transmission lines terminated in 50 Ω to VDD − 2 V. A latch input is included, which permits tracking, track-and-hold, or sample-and-hold modes of operation.

The ADCMP567 is available in a 32-lead LFCSP package.

APPLICATIONS

  • High speed instrumentation
  • Scope and logic analyzer front ends Window comparators
  • High speed line receivers and signal restoration
  • Threshold detection
  • Peak detection
  • High speed triggers
  • Patient diagnostics
  • Disk drive read channel detection
  • Hand-held test instruments Zero-crossing detectors
  • Clock drivers
  • Automatic test equipment
Part Models 1
1ku List Price Starting From $4.71

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Product Lifecycle

PCN

Mar 23, 2012

- 11_0104

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

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Part Models

Product Lifecycle

PCN

Mar 23, 2012

- 11_0104

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Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

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