ADCLK914
Info : RECOMMENDED FOR NEW DESIGNS
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ADCLK914

Ultrafast, SiGe, Open-Collector HVDS Clock/Data Buffer

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 3
1ku List Price Starting From $8.55
Features
  • 7.5 GHz operating frequency
  • 160 ps propagation delay
  • 100 ps output rise/fall
  • 110 fs random jitter
  • On-chip input terminations
  • Extended industrial temperature range: −40°C to +125°C
  • 3.3 V power supply (VCC − VEE)
Additional Details
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The ADCLK914 is an ultrafast clock/data buffer fabricated on the Analog Devices, Inc., proprietary, complementary bipolar (XFCB-3) silicon-germanium (SiGe) process. The ADCLK914 features high voltage differential signaling (HVDS) outputs suitable for driving the latest Analog Devices high speed digitalto-analog converters (DACs). The ADCLK914 has a single, differential open-collector output.

The ADCLK914 buffer operates up to 7.5 GHz with a 160 ps propagation delay and adds only 110 fs random jitter (RJ). The input has a center tapped, 100 Ω, on-chip termination resistor and accepts LVPECL, CML, CMOS, LVTTL, or LVDS (ac-coupled only). A VREF pin is available for biasing ac-coupled inputs.

The HVDS output stage is designed to directly drive 1.9 V each side into 50 Ω terminated to VCC for a total differential output swing of 3.8 V.

The ADCLK914 is available in a 16-lead LFCSP. It is specified for operation over the extended industrial temperature range of −40°C to +125°C.

Applications

  • Clock and data signal restoration
  • High speed converter clocking
  • Broadband communications
  • Cellular infrastructure
  • High speed line receivers
  • ATE and high performance instrumentation
  • Level shifting
  • Threshold detection

 

Part Models 3
1ku List Price Starting From $8.55

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADCLK914BCPZ-R2
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ADCLK914BCPZ-R7
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ADCLK914BCPZ-WP
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Product Lifecycle

PCN

Feb 13, 2014

- 14_0038

Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

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Part Models

Product Lifecycle

PCN

Feb 13, 2014

- 14_0038

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Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Evaluation Kit

Evaluation Kits 1

EVAL-ADCLK914

ADCLK914 Evaluation Board

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EVAL-ADCLK914

ADCLK914 Evaluation Board

ADCLK914 Evaluation Board

Product Detail

The ADCLK914 clock buffer is very fast, making it important to use adequate high bandwidth instruments to evaluate it. To that end, the evaluation board is fabricated using a high quality dielectric material between layers to maintain high signal integrity. Transmission line paths are kept as close to 50 Ω as possible.

Tools & Simulations

Tools & Simulations 2

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