ADCLK907
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ADCLK907

Ultrafast SiGe ECL Clock/Data Buffers

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 3
1ku List Price Starting From $8.40
Features
  • 95 ps propagation delay
  • 7.5 GHz toggle rate
  • 60 ps typical output rise/fall
  • 60 fs random jitter (RJ)
  • On-chip terminations at both input pins
  • Extended industrial temperature range: −40°C to +125°C
  • 2.5 V to 3.3 V power supply (VCC − VEE)
Additional Details
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The ADCLK905 (one input, one output), ADCLK907 (dual one input, one output), and ADCLK925 (one input, two outputs) are ultrafast clock/data buffers fabricated on the Analog Devices, Inc., proprietary XFCB3 silicon germanium (SiGe) bipolar process.

The ADCLK905/ADCLK907/ADCLK925 feature full-swing emitter coupled logic (ECL) output drivers. For PECL (positive ECL) operation, bias VCC to the positive supply and VEE to ground. For NECL (negative ECL) operation, bias VCC to ground and VEE to the negative supply.

The buffers offer 95 ps propagation delay, 7.5 GHz toggle rate, 10 Gbps data rate, and 60 fs random jitter (RJ).

The inputs have center tapped, 100 Ω, on-chip termination resistors. A VREF pin is available for biasing ac-coupled inputs.

The ECL output stages are designed to directly drive 800 mV each side into 50 Ω terminated to VCC − 2 V for a total differential output swing of 1.6 V.

The ADCLK905/ADCLK907/ADCLK925 are available in 16-lead LFCSP packages.

Applications

  • Clock and data signal restoration and level shifting
  • Automated test equipment (ATE)
  • High speed instrumentation
  • High speed line receivers
  • Threshold detection
  • Converter clocking
Part Models 3
1ku List Price Starting From $8.40

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADCLK907BCPZ-R2
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ADCLK907BCPZ-R7
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ADCLK907BCPZ-WP
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Part Models

Product Lifecycle

PCN

Feb 13, 2014

- 14_0038

Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

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Part Models

Product Lifecycle

PCN

Feb 13, 2014

- 14_0038

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Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 1

EVAL-ADCLK907

ADCLK907 Evaluation Board

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EVAL-ADCLK907

ADCLK907 Evaluation Board

ADCLK907 Evaluation Board

Product Detail

The ADCLK905/ADCLK907/ADCLK925 clock buffers are very fast, making it important to use adequate high bandwidth instruments to evaluate them. To that end, the evaluation board is fabricated using a high quality dielectric material between layers to maintain high signal integrity. Transmission line paths are kept as close to 50 Ω as possible.

Tools & Simulations

Tools & Simulations 2

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