AD8300
Info: : PRODUCTION
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AD8300

+3 Volt, Serial Input Complete 12-Bit DAC

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Models 3
1ku List Price Starting From $10.85
Features
  • Complete 12-Bit DAC
  • No External Components
  • Single +3 Volt Operation
  • 0.5 mV/Bit with 2.0475 Full Scale
  • 6 µs Output Voltage Settling Time
  • Low Power: 3.6 mW
  • Compact SO-8 1.5 mm 
  • Height Package
Additional Details
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The AD8300 is a complete 12-bit, voltage-output digital-to-analog converter designed to operate from a single +3 volt supply. Built using a CBCMOS process, this monolithic DAC offers the user low cost, and ease-of-use in single-supply +3 volt systems. Operation is guaranteed over the supply voltage range of +2.7 V to +5.5 V making this device ideal for battery operated applications.

The 2.0475 V full-scale voltage output is laser trimmed to maintain accuracy over the operating temperature range of the device. The binary input data format provides an easy-to-use one-half-millivolt-per-bit software programmability. The voltage outputs are capable of sourcing 5 mA.

A double buffered serial data interface offers high speed, three-wire, DSP and microcontroller compatible inputs using data in (SDI), clock (CLK) and load strobe (LD) pins. A chip select (CS) pin simplifies connection of multiple DAC packages by enabling the clock input when active low. Additionally, a CLR input sets the output to zero scale at power on or upon user demand.

The AD8300 is specified over the extended industrial (-40°C to +85°C) temperature range. AD8300's are available in plastic DIP, and low profile 1.5 mm height SO-8 surface mount packages.

Part Models 3
1ku List Price Starting From $10.85

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD8300ANZ
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AD8300ARZ
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AD8300ARZ-REEL
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Product Lifecycle

PCN

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

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Part Models

Product Lifecycle

PCN

Aug 19, 2009

- 07_0024

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Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

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