AD830
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AD830

High Speed, Video Difference Amplifier

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SPICE Model AD830 SPICE Macro Model Rev. A, 5/93 Download 2.47 K SPICE Model AD830A SPICE Macro Model Rev. A, 5/93 Download 2.58 K SPICE Model AD830J SPICE Macro Model Rev. A, 5/93 Download 2.59 K SPICE Model AD830S SPICE Macro Model Rev. A, 5/93 Download 2.59 K
Part Models 6
1ku List Price Starting From $5.80
Features
  • Differential amplification
  • Wide common-mode voltage range: +12.8 V to −12 V
  • Differential voltage: ±2 V
  • High CMRR: 60 dB at 4 MHz
  • Built-in differential clipping level: ±2.3 V
  • Fast dynamic performance
  • 85 MHz unity gain bandwidth
  • 35 ns settling time to 0.1%
  • 360 V/μs slew rate
  • Symmetrical dynamic response
  • Excellent video specifications
  • See datasheet for additional features

Additional Details
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The AD830 is a wideband, differencing amplifier designed for use at video frequencies but also useful in many other applications. It accurately amplifies a fully differential signal at the input and produces an ouput voltage referred to a user-chosen level. The undesired common-mode signal is rejected, even at high frequencies. High impedance input ease interfacing to finite source impedances and thus preserve the excellent common-mode rejection. In many respects, it offers significant improvements over discrete difference amplifier approaches, in particular in high frequency common-mode rejection.  

The wide common-mode and differential-voltage range of the AD830 make it particularly useful and flexible in level shifting applications, but at lower power dissipation than discrete solutions. Low distortion is preserved over the many possible differential and common-mode voltages at the input and output.

Good gain flatness and excellent differential gain of 0.06% and phase of 0.08° make the AD830 suitable for many video system applications. Furthermore, the AD830 is suited for general purpose signal processing from dc to 10 MHz.

APPLICATIONS

  • Differential line receiver
  • High speed level shifter
  • High speed in-amp
  • Differential to single-ended conversion
  • Resistorless summation and subtraction
  • High speed analog-to-digital converter
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file View Data Sheet (Rev.D)
Documentation View All Documentation
SPICE Model AD830 SPICE Macro Model Rev. A, 5/93 Download 2.47 K SPICE Model AD830A SPICE Macro Model Rev. A, 5/93 Download 2.58 K SPICE Model AD830J SPICE Macro Model Rev. A, 5/93 Download 2.59 K SPICE Model AD830S SPICE Macro Model Rev. A, 5/93 Download 2.59 K
Part Models 6
1ku List Price Starting From $5.80
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AD830

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Data Sheet

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UPDATED 01/01/2000
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AD830: High Speed, Video Difference Amplifier Data Sheet (Rev.D)

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UPDATED 01/01/1999
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AD830: Military Data Sheet

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Application Note

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UPDATED 12/04/2003
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AN-692: Universal Precision Op Amp Evaluation Board (Rev.A) redirect icon

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UPDATED 12/04/2003
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AN-692: 通用精密运算放大器评估板 (Rev.0) redirect icon

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AN-692: 汎用高精度オペアンプ評価用ボード (Rev.A) redirect icon

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UPDATED 02/14/2015
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AN-282: Fundamentals of Sampled Data Systems redirect icon

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AN-282: 采样数据系统基本原理[中文版] (Rev.A) redirect icon

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AN-282: サンプル・データ・システムの基本 redirect icon

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Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-9313001MPA 8-Lead CerDIP external-link
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  • Material Declaration external-link
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AD830ANZ 8-Lead PDIP external-link
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  • Material Declaration external-link
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  • Reliablity Data external-link
AD830ARZ 8-Lead SOIC external-link
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  • Material Declaration external-link
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AD830ARZ-REEL7 8-Lead SOIC external-link
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  • Material Declaration external-link
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  • Reliablity Data external-link
AD830JRZ 8-Lead SOIC external-link
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  • Material Declaration external-link
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AD830JRZ-R7 8-Lead SOIC external-link
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Aug 19, 2009

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Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

AD830ANZ

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PCN

Apr 9, 2018

- 16_0026

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Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-9313001MPA

pdf

PCN16_0026_Form

external-icon

xls

Material_Report

Download
Qualification Results Summary
Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

5962-9313001MPA

pdf

PCN12_0199_Form

external-icon

xls

Material_Report

Download

pdf

Qualification Report Summary

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pdf

Datasheet Specification Comparison

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Jun 6, 2012

- 12_0066

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Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

5962-9313001MPA

pdf

PCN12_0066_Form

external-icon

xls

Material_Report

Download

pdf

Qualification Report Summary

external-icon
Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-9313001MPA

pdf

PCN11_0050_Form

external-icon

xls

Material_Report

Download
Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-9313001MPA

pdf

PCN11_0182_Form

external-icon

xls

Material_Report

Download
Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

AD830ANZ

PRODUCTION

Material_Report.csv

xls

Material_Report

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pdf

Parts List

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pdf

PCN07_0024_Form

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Qual Data

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